Adhesives Technology for Electronic Applications

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: • Tamper-proof adhesives for electronic security devices. • Bio-compatible adhesives for implantable medical devices. • Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). • Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals Provides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel

Produk Detail:

  • Author : James J. Licari
  • Publisher : William Andrew
  • Pages : 512 pages
  • ISBN : 9781437778908
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKAdhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
  • Author : James J. Licari,Dale W. Swanson
  • Publisher : William Andrew
  • Release : 24 June 2011
GET THIS BOOKAdhesives Technology for Electronic Applications

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework

Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
  • Author : James J. Licari,Dale W. Swanson
  • Publisher : William Andrew
  • Release : 15 January 2013
GET THIS BOOKAdhesives Technology for Electronic Applications

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of

Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
  • Author : M O Alam,C Bailey
  • Publisher : Elsevier
  • Release : 25 May 2011
GET THIS BOOKAdvanced Adhesives in Electronics

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
  • Author : Haleh Ardebili,Jiawei Zhang,Michael Pecht
  • Publisher : William Andrew
  • Release : 23 October 2018
GET THIS BOOKEncapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to

Handbook of Adhesives and Surface Preparation

Handbook of Adhesives and Surface Preparation
  • Author : Sina Ebnesajjad
  • Publisher : William Andrew
  • Release : 15 December 2010
GET THIS BOOKHandbook of Adhesives and Surface Preparation

Handbook of Adhesives and Surface Preparation provides a thoroughly practical survey of all aspects of adhesives technology from selection and surface preparation to industrial applications and health and environmental factors. The resulting handbook is a hard‐working reference for a wide range of engineers and technicians working in the adhesives industry and a variety of industry sectors that make considerable use of adhesives. Particular attention is given to adhesives applications in the automotive, aerospace, medical, dental and electronics sectors. A

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
  • Author : Haleh Ardebili,Jiawei Zhang,Michael Pecht
  • Publisher : William Andrew
  • Release : 23 October 2018
GET THIS BOOKEncapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to

Applied Adhesive Bonding in Science and Technology

Applied Adhesive Bonding in Science and Technology
  • Author : Halil Ozer
  • Publisher : BoD – Books on Demand
  • Release : 21 February 2018
GET THIS BOOKApplied Adhesive Bonding in Science and Technology

This book brings together scientists and provides the reader with a comprehensive overview of some recent developments in the field of adhesive bonding with the contributions of internationally recognized authors. This book is divided into three sections: "Structural Adhesive Bonding," "Wood Adhesive Bonding," and "Adhesive Bonding in Medical Applications." Each section presents an important review and some applications of the adhesive bonding in various different disciplines. I hope that the book published in open access will help researchers to benefit

Surface Treatment of Materials for Adhesion Bonding

Surface Treatment of Materials for Adhesion Bonding
  • Author : Sina Ebnesajjad,Cyrus Ebnesajjad
  • Publisher : William Andrew
  • Release : 12 June 2006
GET THIS BOOKSurface Treatment of Materials for Adhesion Bonding

This is a unique compilation of surface preparation principles and techniques for plastics, thermosets, elastomers, and metals bonding. With emphasis on the practical, it draws together in a single source technical principles of surface science and surface treatments technologies of plastics, elastomers, and metals. It is both a reference and a guide for engineers, scientists, practitioners of surface treatment, researchers, students, and others involved in materials adhesion and processing. This book describes and illustrates the surface preparations and operations that

Electrically Conductive Adhesives

Electrically Conductive Adhesives
  • Author : Rajesh Gomatam,Kash L. Mittal
  • Publisher : CRC Press
  • Release : 23 December 2008
GET THIS BOOKElectrically Conductive Adhesives

With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions and a myriad of electronic equipments. Environmentally-friendly ECAs offer many advantages vis-à-vis solder, such as simple and low-temperature processing

Electrical Conductive Adhesives with Nanotechnologies

Electrical Conductive Adhesives with Nanotechnologies
  • Author : Yi (Grace) Li,Daniel Lu,C.P. Wong
  • Publisher : Springer Science & Business Media
  • Release : 08 October 2009
GET THIS BOOKElectrical Conductive Adhesives with Nanotechnologies

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied

Handbook of Adhesives and Surface Preparation

Handbook of Adhesives and Surface Preparation
  • Author : Sina Ebnesajjad
  • Publisher : William Andrew
  • Release : 15 December 2010
GET THIS BOOKHandbook of Adhesives and Surface Preparation

Handbook of Adhesives and Surface Preparation provides a thoroughly practical survey of all aspects of adhesives technology from selection and surface preparation to industrial applications and health and environmental factors. The resulting handbook is a hard‐working reference for a wide range of engineers and technicians working in the adhesives industry and a variety of industry sectors that make considerable use of adhesives. Particular attention is given to adhesives applications in the automotive, aerospace, medical, dental and electronics sectors. A

Adhesive Bonding

Adhesive Bonding
  • Author : R D Adams
  • Publisher : Elsevier
  • Release : 08 March 2005
GET THIS BOOKAdhesive Bonding

This important collection reviews key research on adhesive behaviour and applications in sectors as diverse as construction and automotive engineering. The book is divided into three main parts: fundamentals, mechanical properties and applications. Part one focuses on the basic properties of adhesives, surface assessment and treatment. Part two concentrates on understanding how adhesives perform under stress and the factors affecting fatigue and failure. The final part of the book reviews industry specific applications in areas such as building and construction,

Adhesion in Microelectronics

Adhesion in Microelectronics
  • Author : K. L. Mittal,Tanweer Ahsan
  • Publisher : John Wiley & Sons
  • Release : 25 August 2014
GET THIS BOOKAdhesion in Microelectronics

This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of

Handbook of Adhesion Technology

Handbook of Adhesion Technology
  • Author : Lucas F. M. da Silva,Andreas Öchsner,Robert D. Adams
  • Publisher : Springer Science & Business Media
  • Release : 10 June 2011
GET THIS BOOKHandbook of Adhesion Technology

Adhesives have been used for thousands of years, but until 100 years ago, the vast majority was from natural products such as bones, skins, fish, milk, and plants. Since about 1900, adhesives based on synthetic polymers have been introduced, and today, there are many industrial uses of adhesives and sealants. It is difficult to imagine a product—in the home, in industry, in transportation, or anywhere else for that matter—that does not use adhesives or sealants in some manner. The Handbook