Advanced Adhesives in Electronics

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

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  • Author : M O Alam
  • Publisher : Elsevier
  • Pages : 280 pages
  • ISBN : 0857092898
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKAdvanced Adhesives in Electronics

Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
  • Author : M O Alam,C Bailey
  • Publisher : Elsevier
  • Release : 25 May 2011
GET THIS BOOKAdvanced Adhesives in Electronics

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part

Advanced Piezoelectric Materials

Advanced Piezoelectric Materials
  • Author : Kenji Uchino
  • Publisher : Elsevier
  • Release : 27 September 2010
GET THIS BOOKAdvanced Piezoelectric Materials

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and

Polymers in Organic Electronics

Polymers in Organic Electronics
  • Author : Sulaiman Khalifeh
  • Publisher : Elsevier
  • Release : 01 April 2020
GET THIS BOOKPolymers in Organic Electronics

Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes,

Adhesion in Microelectronics

Adhesion in Microelectronics
  • Author : K. L. Mittal,Tanweer Ahsan
  • Publisher : John Wiley & Sons
  • Release : 25 August 2014
GET THIS BOOKAdhesion in Microelectronics

This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of

Electronics Applications of Polymers II

Electronics Applications of Polymers II
  • Author : M.T. Goosey
  • Publisher : iSmithers Rapra Publishing
  • Release : 18 January 2021
GET THIS BOOKElectronics Applications of Polymers II

Electronics applications of polymers continue to advance, and this report describes the major developments in the last decade. The report looks at the important properties of polymers and discusses their role in printed circuit board (PCB) and related interconnect applications and in microelectronics. Additionally, the various lithographic routes available for future semiconductor device manufacture are discussed. An additional indexed section containing several hundred abstracts from the Rapra Polymer Library database gives useful references for further reading.

Electrical Conductive Adhesives with Nanotechnologies

Electrical Conductive Adhesives with Nanotechnologies
  • Author : Yi (Grace) Li,Daniel Lu,C.P. Wong
  • Publisher : Springer Science & Business Media
  • Release : 08 October 2009
GET THIS BOOKElectrical Conductive Adhesives with Nanotechnologies

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied

Advanced Organics for Electronic Substrates and Packages

Advanced Organics for Electronic Substrates and Packages
  • Author : Andrew E Fletcher
  • Publisher : Elsevier
  • Release : 22 October 2013
GET THIS BOOKAdvanced Organics for Electronic Substrates and Packages

Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection,

Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
  • Author : James J. Licari,Dale W. Swanson
  • Publisher : Elsevier
  • Release : 30 August 2005
GET THIS BOOKAdhesives Technology for Electronic Applications

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of

Nano-Bio- Electronic, Photonic and MEMS Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging
  • Author : C.P. Wong,Kyoung-Sik Moon,Yi (Grace) Li
  • Publisher : Springer Science & Business Media
  • Release : 23 December 2009
GET THIS BOOKNano-Bio- Electronic, Photonic and MEMS Packaging

Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.

Electrically Conductive Adhesives

Electrically Conductive Adhesives
  • Author : Rajesh Gomatam,Kashmiri Lal Mittal
  • Publisher : BRILL
  • Release : 23 December 2008
GET THIS BOOKElectrically Conductive Adhesives

This book is based on two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to the logic of electrically conductive adhesives. The contains a total of 21 papers (reflecting overviews and original research).

Handbook of Adhesives and Sealants

Handbook of Adhesives and Sealants
  • Author : Philippe Cognard
  • Publisher : Elsevier
  • Release : 14 July 2005
GET THIS BOOKHandbook of Adhesives and Sealants

Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles,

Adhesives, Sealants and Coatings for the Electronics Industry

Adhesives, Sealants and Coatings for the Electronics Industry
  • Author : Ernest W. Flick
  • Publisher : William Andrew
  • Release : 18 January 1992
GET THIS BOOKAdhesives, Sealants and Coatings for the Electronics Industry

The second edition of this widely accepted industrial guide contains descriptions of more than 2,500 adhesives, sealants, and coatings, which are available to the electronics and related industries. The book, greatly expanded from the previous edition, is the result of information received from 80 manufacturers and distributors of these products. The data, including product specifications, represent selections from the manufacturers' descriptions made at no cost to, nor influence from, the makers or distributors of these materials. Only the most recent information has

Graphene, Carbon Nanotubes, and Nanostructures

Graphene, Carbon Nanotubes, and Nanostructures
  • Author : James E. Morris,Krzysztof Iniewski
  • Publisher : CRC Press
  • Release : 28 July 2017
GET THIS BOOKGraphene, Carbon Nanotubes, and Nanostructures

Graphene, Carbon Nanotubes, and Nanostructures: Techniques and Applications offers a comprehensive review of groundbreaking research in nanofabrication technology and explores myriad applications that this technology has enabled. The book examines the historical evolution and emerging trends of nanofabrication and supplies an analytical understanding of some of the most important underlying nanofabrication technologies, with an emphasis on graphene, carbon nanotubes (CNTs), and nanowires. Featuring contributions by experts from academia and industry around the world, this book presents cutting-edge nanofabrication research in