Advanced Adhesives in Electronics

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Produk Detail:

  • Author : M O Alam
  • Publisher : Elsevier
  • Pages : 280 pages
  • ISBN : 0857092898
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKAdvanced Adhesives in Electronics

Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
  • Author : M O Alam,C Bailey
  • Publisher : Elsevier
  • Release : 25 May 2011
GET THIS BOOKAdvanced Adhesives in Electronics

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part

Advanced Piezoelectric Materials

Advanced Piezoelectric Materials
  • Author : Kenji Uchino
  • Publisher : Elsevier
  • Release : 27 September 2010
GET THIS BOOKAdvanced Piezoelectric Materials

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and

Polymers in Organic Electronics

Polymers in Organic Electronics
  • Author : Sulaiman Khalifeh
  • Publisher : Elsevier
  • Release : 01 April 2020
GET THIS BOOKPolymers in Organic Electronics

Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes,

Adhesion in Microelectronics

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  • Author : K. L. Mittal,Tanweer Ahsan
  • Publisher : John Wiley & Sons
  • Release : 25 August 2014
GET THIS BOOKAdhesion in Microelectronics

This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials asit pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array ofpertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of

Waste Electrical and Electronic Equipment (WEEE) Handbook

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  • Author : Vannessa Goodship,Ab Stevels
  • Publisher : Elsevier
  • Release : 30 August 2012
GET THIS BOOKWaste Electrical and Electronic Equipment (WEEE) Handbook

Electrical and electronic waste is a growing problem as volumes are increasing fast. Rapid product innovation and replacement, especially in information and communication technologies (ICT), combined with the migration from analog to digital technologies and to flat-screen televisions and monitors has resulted in some electronic products quickly reaching the end of their life. The EU directive on waste electrical and electronic equipment (WEEE) aims to minimise WEEE by putting organizational and financial responsibility on producers and distributors for collection, treatment,

Advances in Chemical Mechanical Planarization (CMP)

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  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 09 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

Advances in Non-volatile Memory and Storage Technology

Advances in Non-volatile Memory and Storage Technology
  • Author : Yoshio Nishi
  • Publisher : Elsevier
  • Release : 24 June 2014
GET THIS BOOKAdvances in Non-volatile Memory and Storage Technology

New solutions are needed for future scaling down of nonvolatile memory. Advances in Non-volatile Memory and Storage Technology provides an overview of developing technologies and explores their strengths and weaknesses. After an overview of the current market, part one introduces improvements in flash technologies, including developments in 3D NAND flash technologies and flash memory for ultra-high density storage devices. Part two looks at the advantages of designing phase change memory and resistive random access memory technologies. It looks in particular

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  • Author : Stavros Pissadakis,Stefano Selleri
  • Publisher : Woodhead Publishing
  • Release : 19 May 2015
GET THIS BOOKOptofluidics, Sensors and Actuators in Microstructured Optical Fibers

Combining the positive characteristics of microfluidics and optics, microstructured optical fibres (MOFs) have revolutionized the field of optoelectronics. Tailored guiding, diffractive structures and photonic band-gap effects are used to produce fibres with highly specialised, complex structures, facilitating the development of novel kinds of optical fibre sensors and actuators. Part One outlines the key materials and fabrication techniques used for microstructured optical fibres. Microfluidics and heat flows, MOF-based metamaterials, novel and liquid crystal infiltrated photonic crystal fibre (PCF) designs, MOFs filled

Advances in Delay-tolerant Networks (DTNs)

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  • Author : J Rodrigues
  • Publisher : Elsevier
  • Release : 20 November 2014
GET THIS BOOKAdvances in Delay-tolerant Networks (DTNs)

Part one looks at delay-tolerant network architectures and platforms including DTN for satellite communications and deep-space communications, underwater networks, networks in developing countries, vehicular networks and emergency communications. Part two covers delay-tolerant network routing, including issues such as congestion control, naming, addressing and interoperability. Part three explores services and applications in delay-tolerant networks, such as web browsing, social networking and data streaming. Part four discusses enhancing the performance, reliability, privacy and security of delay-tolerant networks. Chapters cover resource sharing, simulation

Handbook of Flexible Organic Electronics

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  • Author : Stergios Logothetidis
  • Publisher : Elsevier
  • Release : 15 December 2014
GET THIS BOOKHandbook of Flexible Organic Electronics

Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one

Reliability Characterisation of Electrical and Electronic Systems

Reliability Characterisation of Electrical and Electronic Systems
  • Author : Jonathan Swingler
  • Publisher : Elsevier
  • Release : 24 December 2014
GET THIS BOOKReliability Characterisation of Electrical and Electronic Systems

This book takes a holistic approach to reliability engineering for electrical and electronic systems by looking at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability for a range of devices. The text describes the reliability behavior of electrical and electronic systems. It takes an empirical scientific approach to reliability engineering to facilitate a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic

Handbook of Organic Materials for Optical and (Opto)Electronic Devices

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  • Author : Oksana Ostroverkhova
  • Publisher : Elsevier
  • Release : 31 August 2013
GET THIS BOOKHandbook of Organic Materials for Optical and (Opto)Electronic Devices

Small molecules and conjugated polymers, the two main types of organic materials used for optoelectronic and photonic devices, can be used in a number of applications including organic light-emitting diodes, photovoltaic devices, photorefractive devices and waveguides. Organic materials are attractive due to their low cost, the possibility of their deposition from solution onto large-area substrates, and the ability to tailor their properties. The Handbook of organic materials for optical and (opto)electronic devices provides an overview of the properties of

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  • Author : Serge Zhuiykov
  • Publisher : Woodhead Publishing
  • Release : 14 February 2014
GET THIS BOOKNanostructured Semiconductor Oxides for the Next Generation of Electronics and Functional Devices

Nanostructured Semiconductor Oxides for the Next Generation of Electronics and Functional Devices focuses on the development of semiconductor nanocrystals, their technologies and applications, including energy harvesting, solar cells, solid oxide fuel cells, and chemical sensors. Semiconductor oxides are used in electronics, optics, catalysts, sensors, and other functional devices. In their 2D form, the reduction in size confers exceptional properties, useful for creating faster electronics and more efficient catalysts. After explaining the physics affecting the conductivity and electron arrangement of nanostructured

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  • Publisher : Woodhead Publishing
  • Release : 13 February 2014
GET THIS BOOKMetallic Films for Electronic, Optical and Magnetic Applications

Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus

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  • Publisher : Elsevier
  • Release : 26 February 2011
GET THIS BOOKSilicon-Germanium (SiGe) Nanostructures

Nanostructured silicon-germanium (SiGe) opens up the prospects of novel and enhanced electronic device performance, especially for semiconductor devices. Silicon-germanium (SiGe) nanostructures reviews the materials science of nanostructures and their properties and applications in different electronic devices. The introductory part one covers the structural properties of SiGe nanostructures, with a further chapter discussing electronic band structures of SiGe alloys. Part two concentrates on the formation of SiGe nanostructures, with chapters on different methods of crystal growth such as molecular beam epitaxy