Advanced Polyimide Materials

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared

Produk Detail:

  • Author : Shi-Yong Yang
  • Publisher : Elsevier
  • Pages : 498 pages
  • ISBN : 9780128126400
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKAdvanced Polyimide Materials

Advanced Polyimide Materials

Advanced Polyimide Materials
  • Author : Shi-Yong Yang
  • Publisher : Elsevier
  • Release : 18 April 2018
GET THIS BOOKAdvanced Polyimide Materials

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties,

Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications

Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications
  • Author : Kash L. Mittal
  • Publisher : CRC Press
  • Release : 18 April 2005
GET THIS BOOKPolyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications

This volume chronicles the proceedings of the Third International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization, and Applications, held in Orlando, December 17-19, 2003. This volume is divided into three parts. Part 1. “Synthesis, Properties and Bulk Characterization”; Part 2 “Hybrids and Composites” and Part 3 “Applications and General Papers”. The topics covered include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; hybrids and nanocomposites using these materials and

Textile-Based Advanced Materials

Textile-Based Advanced Materials
  • Author : Thomas Bechtold,Avinash P. Manian
  • Publisher : MDPI
  • Release : 17 March 2021
GET THIS BOOKTextile-Based Advanced Materials

Developments in the science and technology of textiles are not only limited to apparel and fashion. Certainly, there are research efforts aimed at improving the construction and processing of textiles for clothing—such as studies on cleaner production to reduce environmental impact, increasing the utilization of fibers and process chemicals from renewable resources, and on the recycling of materials from post-consumer waste apparel back into the manufacturing of new clothing articles. In addition, technological concepts developed for the creation of

Fillers and Reinforcements for Advanced Nanocomposites

Fillers and Reinforcements for Advanced Nanocomposites
  • Author : Yu Dong,Rehan Umer,Alan Kin Tak Lau
  • Publisher : Woodhead Publishing
  • Release : 02 July 2015
GET THIS BOOKFillers and Reinforcements for Advanced Nanocomposites

Fillers and Reinforcements for Advanced Nanocomposites reviews cutting-edge, state-of-the-art research on the effective use of nanoscaled fillers and reinforcements to enhance the performance of advanced nanocomposites, both in industrial and manufacturing applications. It covers a broad range of topics such as nanocelluloses, nanotubes, nanoplatelets, and nanoparticles, as well as their extensive applications. The chapters provide detailed information on how fillers and reinforcements are used in the fabrication, synthesis and characterization of advanced nanocomposites to achieve extraordinary performance of new materials

Polymer/POSS Nanocomposites and Hybrid Materials

Polymer/POSS Nanocomposites and Hybrid Materials
  • Author : Susheel Kalia,Krzysztof Pielichowski
  • Publisher : Springer
  • Release : 27 November 2018
GET THIS BOOKPolymer/POSS Nanocomposites and Hybrid Materials

This book provides an overview of polymer nanocomposites and hybrid materials with polyhedral oligomeric silsesquioxanes (POSS). Among inorganic nanoparticles, functionalized POSS are unique nano-building blocks that can be used to create a wide variety of hybrid and composite materials, where precise control of nanostructures and properties is required. This book describes the influence of incorporation of POSS moieties into (organic) polymer matrices on the mechanical, thermal and flammability behavior of composites and hybrid organic-inorganic materials. Importantly, POSS-containing materials can be

Emerging Nanoelectronic Devices

Emerging Nanoelectronic Devices
  • Author : An Chen,James Hutchby,Victor Zhirnov,George Bourianoff
  • Publisher : John Wiley & Sons
  • Release : 26 November 2014
GET THIS BOOKEmerging Nanoelectronic Devices

Emerging Nanoelectronic Devices focuses on the future direction of semiconductor and emerging nanoscale device technology. As the dimensional scaling of CMOS approaches its limits, alternate information processing devices and microarchitectures are being explored to sustain increasing functionality at decreasing cost into the indefinite future. This is driving new paradigms of information processing enabled by innovative new devices, circuits, and architectures, necessary to support an increasingly interconnected world through a rapidly evolving internet. This original title provides a fresh perspective on

Development of Polyimide Materials for Use in Solar Energy Systems. Semi-annual Technical Progress Report, August 1, 1978-January 31, 1979

Development of Polyimide Materials for Use in Solar Energy Systems. Semi-annual Technical Progress Report, August 1, 1978-January 31, 1979
  • Author : Anonim
  • Publisher : Unknown Publisher
  • Release : 11 April 1979
GET THIS BOOKDevelopment of Polyimide Materials for Use in Solar Energy Systems. Semi-annual Technical Progress Report, August 1, 1978-January 31, 1979

This report covers six months of effort on a program to optimize and characterize improved insulation materials for solar energy systems. Two separate and distinct products have been studied, a lightweight flexible insulating foam and a high density, rigid, load bearing insulating foam. These products are derived from a polyimide resin, the formulations and processes for which were developed under NASA-JSC sponsored programs. These materials are non-burning and do not emit measurable quantities of smoke or toxic byproducts. Candidate resins

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
  • Author : Beth Keser,Steffen Kroehnert
  • Publisher : Wiley-IEEE Press
  • Release : 20 February 2019
GET THIS BOOKAdvances in Embedded and Fan-Out Wafer Level Packaging Technologies

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain.

Polyimides

Polyimides
  • Author : Doug Wilson,Horst D. Stenzenberger,Paul M. Hergenrother
  • Publisher : Springer Science & Business Media
  • Release : 21 November 2013
GET THIS BOOKPolyimides

The last twenty years or so have seen a flurry of activity in the synthesis of new polymer systems. This interest has developed largely as a result of the increased need for advanced materials. Despite the emergence of a number of outstanding polymers, it is the polyimides that have captured the imagination of scientists and engineers alike as materials that offer outstanding promise for the high technology applic ations of the future. The reputation of the polyimide has been established

Polyimides and Other High-temperature Polymers

Polyimides and Other High-temperature Polymers
  • Author : K. L. Mittal
  • Publisher : BRILL
  • Release : 24 April 2009
GET THIS BOOKPolyimides and Other High-temperature Polymers

The topics covered in this proceedings volume include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.

Advanced and Emerging Polybenzoxazine Science and Technology

Advanced and Emerging Polybenzoxazine Science and Technology
  • Author : Hatsuo Ishida,Pablo Froimowicz
  • Publisher : Elsevier
  • Release : 18 January 2017
GET THIS BOOKAdvanced and Emerging Polybenzoxazine Science and Technology

Advanced and Emerging Polybenzoxazine Science and Technology introduces advanced topics of benzoxazine resins and polybenzoxazines as presented through the collaboration of leading experts in the benzoxazine community, representing the authoritative introduction to the subjects. Broad topics covered include the recent development and improved understanding of the subjects, including low temperature cure, aerogels and carbon aerogels, smart chemistry in fire retarding materials and coatings, metal containing benzoxazines, rational design of advanced properties, and materials from natural renew. In the past twenty

Advanced Materials Science and Engineering of Carbon

Advanced Materials Science and Engineering of Carbon
  • Author : Michio Inagaki,Feiyu Kang,Masahiro Toyoda,Hidetaka Konno
  • Publisher : Butterworth-Heinemann
  • Release : 31 August 2013
GET THIS BOOKAdvanced Materials Science and Engineering of Carbon

Carbon materials are exceptionally diverse in their preparation, structure, texture, and applications. In Advanced Materials Science and Engineering of Carbon, noted carbon scientist Michio Inagaki and his coauthors cover the most recent advances in carbon materials, including new techniques and processes, carbon materials synthesis, and up-to-date descriptions of current carbon-based materials, trends and applications. Beginning with the synthesis and preparation of nanocarbons, carbon nanotubes, and graphenes, the book then reviews recently developed carbonization techniques, such as templating, electrospinning, foaming, stress

Polyimides

Polyimides
  • Author : K.L. Mittal
  • Publisher : Springer Science & Business Media
  • Release : 29 June 2013
GET THIS BOOKPolyimides

This and its companion Volume 2 chronicle the proceedings of the First Technical Conference on Polyimides: Synthesis, Char acterization and Applications held under the auspices of the Mid Hudson Section of the Society of Plastics Engineers at Ellenville, New York, November 10-12, 1982. In the last decade or so there has been an accelerated interest in the use of polyimides for a variety of applications in a number of widely differing technologies. The applications of polyimides range from aerospace to microelectronics to