Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Produk Detail:

  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Pages : 536 pages
  • ISBN : 0081002181
  • Rating : 4/5 from 1 reviews
CLICK HERE TO GET THIS BOOKAdvances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 09 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 01 December 2011
GET THIS BOOKAdvances in CMP/polishing Technologies for the Manufacture of Electronic Devices

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This

Advances in Chemical Mechanical Planarization (Cmp)

Advances in Chemical Mechanical Planarization (Cmp)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing Limited
  • Release : 12 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (Cmp)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

Advances in Chemical-Mechanical Polishing: Volume 816

Advances in Chemical-Mechanical Polishing: Volume 816
  • Author : Materials Research Society. Meeting
  • Publisher : Unknown Publisher
  • Release : 01 September 2004
GET THIS BOOKAdvances in Chemical-Mechanical Polishing: Volume 816

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other

Advances in CMP Polishing Technologies

Advances in CMP Polishing Technologies
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 30 November 2011
GET THIS BOOKAdvances in CMP Polishing Technologies

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book

Advances and Challenges in Chemical Mechanical Planarization:

Advances and Challenges in Chemical Mechanical Planarization:
  • Author : Gerfried Zwicker,Christopher Borst,Laertis Economikos,Ara Philipossian
  • Publisher : Cambridge University Press
  • Release : 05 June 2014
GET THIS BOOKAdvances and Challenges in Chemical Mechanical Planarization:

Chemical mechanical planarization (CMP) has been a leading-edge technology in semiconductor processing for the past 15−20 years. A successful CMP process is based in fundamental science across the disciplines of mechanical engineering, chemical engineering, colloid science, materials science and chemistry. Traditionally, the MRS Spring Meeting serves as a nexus for multidisciplinary interaction and discussion between CMP researchers in both industry and academia. The papers in this book are from the 2007 MRS Spring Meeting and address the fluid and wear mechanics that

Advances in Abrasive Based Machining and Finishing Processes

Advances in Abrasive Based Machining and Finishing Processes
  • Author : S. Das,G. Kibria,B. Doloi,B. Bhattacharyya
  • Publisher : Springer Nature
  • Release : 10 May 2020
GET THIS BOOKAdvances in Abrasive Based Machining and Finishing Processes

This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with

Advances in Chemical-Mechanical Polishing:

Advances in Chemical-Mechanical Polishing:
  • Author : Duane S. Boning,Johann W. Bartha,Ara Philipossian,Greg Shinn,Ingrid Vos
  • Publisher : Cambridge University Press
  • Release : 05 June 2014
GET THIS BOOKAdvances in Chemical-Mechanical Polishing:

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other

Abrasive Technology

Abrasive Technology
  • Author : Anna Rudawska
  • Publisher : BoD – Books on Demand
  • Release : 24 October 2018
GET THIS BOOKAbrasive Technology

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics

Emerging Contaminants

Emerging Contaminants
  • Author : Aurel Nuro
  • Publisher : BoD – Books on Demand
  • Release : 27 May 2021
GET THIS BOOKEmerging Contaminants

Emerging Contaminants presents the reader with information on classification, recent studies, and adverse effects on the environment and human health of the main classes of contaminants. Emerging contaminants are synthetic or natural compounds and microorganisms produced and used by humans that cause adverse ecological and human health effects when they reach the environment. This book is organized into four sections that cover the classification of contaminants and the instrumental techniques used to quantify them, recent studies on pesticides, antibiotics as

Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers

Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers
  • Author : Imin Cao,Milind Bhagavat
  • Publisher : John Wiley & Sons
  • Release : 31 December 2020
GET THIS BOOKWafer Manufacturing: Shaping of Single Crystal Silicon Wafers

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.