Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Produk Detail:

  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Pages : 536 pages
  • ISBN : 0081002181
  • Rating : 4/5 from 1 reviews
CLICK HERE TO GET THIS BOOKAdvances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 09 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

Advances in Chemical-Mechanical Polishing: Volume 816

Advances in Chemical-Mechanical Polishing: Volume 816
  • Author : Materials Research Society. Meeting
  • Publisher : Unknown Publisher
  • Release : 01 September 2004
GET THIS BOOKAdvances in Chemical-Mechanical Polishing: Volume 816

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 01 December 2011
GET THIS BOOKAdvances in CMP/polishing Technologies for the Manufacture of Electronic Devices

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This

Advances in Abrasive Based Machining and Finishing Processes

Advances in Abrasive Based Machining and Finishing Processes
  • Author : S. Das,G. Kibria,B. Doloi,B. Bhattacharyya
  • Publisher : Springer Nature
  • Release : 10 May 2020
GET THIS BOOKAdvances in Abrasive Based Machining and Finishing Processes

This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with

Advances in Manufacturing Technology XXXIII

Advances in Manufacturing Technology XXXIII
  • Author : Y. Jin,M. Price
  • Publisher : IOS Press
  • Release : 22 August 2019
GET THIS BOOKAdvances in Manufacturing Technology XXXIII

The development and management of technologies and operations are key to the success of all types of manufacturing business. This book presents the proceedings of the 17th International Conference on Manufacturing Research (ICMR 2019), held in Belfast, UK, on 10 – 12 September 2019. ICMR has been the UK’s main manufacturing research conference for 34 years and an international conference since 2003. It brings together researchers, academics and industrialists to share their vision, knowledge and experience and discuss emerging trends and new challenges in manufacturing research.

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization
  • Author : Yuzhuo Li
  • Publisher : John Wiley & Sons
  • Release : 04 December 2007
GET THIS BOOKMicroelectronic Applications of Chemical Mechanical Planarization

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals

Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials
  • Author : Joseph M. Steigerwald,Shyam P. Murarka,Ronald J. Gutmann
  • Publisher : John Wiley & Sons
  • Release : 26 September 2008
GET THIS BOOKChemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of

Advances in Materials Manufacturing Science and Technology II

Advances in Materials Manufacturing Science and Technology II
  • Author : Chengyu Jiang
  • Publisher : Trans Tech Publication
  • Release : 16 April 2021
GET THIS BOOKAdvances in Materials Manufacturing Science and Technology II

The present volume contains 293 selected and peer-reviewed papers, carefully chosen from among the more than 500 papers presented, by worldwide specialists from industry and academia, at the 12th International Manufacturing Conference in China; organized by the Northwestern Polytechnic University.

Advances in Abrasive Processes

Advances in Abrasive Processes
  • Author : Xipeng Xu,Jianyun Shen,Yuan Li
  • Publisher : Trans Tech Publication
  • Release : 16 April 2021
GET THIS BOOKAdvances in Abrasive Processes

Extensive research during the past 30 years has provided a relatively complete understanding of the many diverse aspects of abrasive processes which are suitable for the final machining of components that require smooth surfaces and precise tolerances. Although widely used in industry, abrasive treatments remain perhaps the least understood of all machining processes. Advances in the field of abrasive processes are therefore of great fundamental and practical interest.