Advances in CMP Polishing Technologies

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology – the science of friction, wear and lubrication – the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Produk Detail:

  • Author : Toshiro Doi
  • Publisher : William Andrew
  • Pages : 328 pages
  • ISBN : 1437778607
  • Rating : 5/5 from 1 reviews
CLICK HERE TO GET THIS BOOKAdvances in CMP Polishing Technologies

Advances in CMP Polishing Technologies

Advances in CMP Polishing Technologies
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 30 November 2011
GET THIS BOOKAdvances in CMP Polishing Technologies

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field – making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book

Advances in Cmp Polishing Technologies

Advances in Cmp Polishing Technologies
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 13 November 2017
GET THIS BOOKAdvances in Cmp Polishing Technologies

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book

Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 24 September 2021
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP/polishing Technologies for the Manufacture of Electronic Devices
  • Author : Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
  • Publisher : William Andrew
  • Release : 01 December 2011
GET THIS BOOKAdvances in CMP/polishing Technologies for the Manufacture of Electronic Devices

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This

Advances in Chemical Mechanical Planarization (Cmp)

Advances in Chemical Mechanical Planarization (Cmp)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing Limited
  • Release : 12 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (Cmp)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

Abrasive Technology

Abrasive Technology
  • Author : Anna Rudawska
  • Publisher : BoD – Books on Demand
  • Release : 24 October 2018
GET THIS BOOKAbrasive Technology

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics

Chemical-Mechanical Planarization of Semiconductor Materials

Chemical-Mechanical Planarization of Semiconductor Materials
  • Author : M.R. Oliver
  • Publisher : Springer Science & Business Media
  • Release : 26 January 2004
GET THIS BOOKChemical-Mechanical Planarization of Semiconductor Materials

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Advances in Chemical-Mechanical Polishing: Volume 816

Advances in Chemical-Mechanical Polishing: Volume 816
  • Author : Materials Research Society. Meeting
  • Publisher : Unknown Publisher
  • Release : 01 September 2004
GET THIS BOOKAdvances in Chemical-Mechanical Polishing: Volume 816

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other

Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 09 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

Advances in Manufacturing Technology XVI - NCMR 2002

Advances in Manufacturing Technology XVI - NCMR 2002
  • Author : Kai Cheng,David Webb
  • Publisher : John Wiley & Sons
  • Release : 22 November 2002
GET THIS BOOKAdvances in Manufacturing Technology XVI - NCMR 2002

Advances in Manufacturing Technology XVI provides a comprehensive collection of papers exploring the very latest developments in the field of manufacturing engineering and managment and incorporates the most up-to-date techniques. TOPICS COVERED INCLUDE: Business strategies process reengineering CAD/CAM and concurrent engineering E-manufacturing and virtual reality Engineering modelling and simulations Total quality management and metrology Intelligent systems. robotics and automation Lean and agiel manufacturing Machining process and tooling Operations management Process control and condition monitoring Covering all aspects of manufacturing

Advances in Chemical-Mechanical Polishing:

Advances in Chemical-Mechanical Polishing:
  • Author : Duane S. Boning,Johann W. Bartha,Ara Philipossian,Greg Shinn,Ingrid Vos
  • Publisher : Cambridge University Press
  • Release : 05 June 2014
GET THIS BOOKAdvances in Chemical-Mechanical Polishing:

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other

Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers

Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers
  • Author : Imin Cao,Milind Bhagavat
  • Publisher : John Wiley & Sons
  • Release : 22 March 2021
GET THIS BOOKWafer Manufacturing: Shaping of Single Crystal Silicon Wafers

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

Sulfur Acids—Advances in Research and Application: 2013 Edition

Sulfur Acids—Advances in Research and Application: 2013 Edition
  • Author : Anonim
  • Publisher : ScholarlyEditions
  • Release : 21 June 2013
GET THIS BOOKSulfur Acids—Advances in Research and Application: 2013 Edition

Sulfur Acids—Advances in Research and Application: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Sulfinic Acids. The editors have built Sulfur Acids—Advances in Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Sulfinic Acids in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Sulfur Acids—Advances in Research and

Tribosystem Analysis

Tribosystem Analysis
  • Author : Peter J. Blau
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOKTribosystem Analysis

Tribosystem Analysis: A Practical Approach to the Diagnosis of Wear Problems provides a systematic framework for conducting root cause analyses and categorizing various types of wear. Designed specifically for engineers without formal training in tribology, this book: Describes a number of direct and indirect methods for detecting and quantifying wear problems Surveys different microscopy techniques, including those for light optics, electron optics, and acoustic imaging Discusses the selection of wear and friction test methods, both standard and custom, identifying possible