CMOS Past Present and Future

CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements. Addresses challenges and opportunities for the use of CMOS Covers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic components Provides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities

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  • Author : Henry Radamson
  • Publisher : Woodhead Publishing
  • Pages : 278 pages
  • ISBN : 0081021402
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKCMOS Past Present and Future

CMOS Past, Present and Future

CMOS Past, Present and Future
  • Author : Henry Radamson,Eddy Simoen,Jun Luo,Chao Zhao
  • Publisher : Woodhead Publishing
  • Release : 03 April 2018
GET THIS BOOKCMOS Past, Present and Future

CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of

Securitization: Past, Present and Future

Securitization: Past, Present and Future
  • Author : Solomon Y Deku,Alper Kara
  • Publisher : Springer
  • Release : 04 August 2017
GET THIS BOOKSecuritization: Past, Present and Future

This book aims to explore if and how securitization changed financial intermediation and lending behaviour by reviewing the pre- and post-financial crisis theoretical and empirical literature. The book’s distinctive feature is bringing the growing post-crisis empirical evidence to the attention of a wider audience by critically appraising it against pre-crisis arguments. With its thought-provoking insights, this book is of particular interest for students, practitioners and academics.

SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices

SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices
  • Author : D. Harame
  • Publisher : The Electrochemical Society
  • Release : 01 October 2010
GET THIS BOOKSiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices

Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.

FinFET Devices for VLSI Circuits and Systems

FinFET Devices for VLSI Circuits and Systems
  • Author : Samar K. Saha
  • Publisher : CRC Press
  • Release : 15 July 2020
GET THIS BOOKFinFET Devices for VLSI Circuits and Systems

To surmount the continuous scaling challenges of MOSFET devices, FinFETs have emerged as the real alternative for use as the next generation device for IC fabrication technology. The objective of this book is to provide the basic theory and operating principles of FinFET devices and technology, an overview of FinFET device architecture and manufacturing processes, and detailed formulation of FinFET electrostatic and dynamic device characteristics for IC design and manufacturing. Thus, this book caters to practicing engineers transitioning to FinFET

Fundamentals of Photonics

Fundamentals of Photonics
  • Author : Bahaa E. A. Saleh,Malvin Carl Teich
  • Publisher : John Wiley & Sons
  • Release : 27 February 2019
GET THIS BOOKFundamentals of Photonics

Fundamentals of Photonics A complete, thoroughly updated, full-color third edition Fundamentals of Photonics, Third Edition is a self-contained and up-to-date introductory-level textbook that thoroughly surveys this rapidly expanding area of engineering and applied physics. Featuring a blend of theory and applications, coverage includes detailed accounts of the primary theories of light, including ray optics, wave optics, electromagnetic optics, and photon optics, as well as the interaction of light and matter. Presented at increasing levels of complexity, preliminary sections build toward

Photonics and Electronics with Germanium

Photonics and Electronics with Germanium
  • Author : Kazumi Wada,Lionel C. Kimerling
  • Publisher : John Wiley & Sons
  • Release : 06 May 2015
GET THIS BOOKPhotonics and Electronics with Germanium

Representing a further step towards enabling the convergence of computing and communication, this handbook and reference treats germanium electronics and optics on an equal footing. Renowned experts paint the big picture, combining both introductory material and the latest results. The first part of the book introduces readers to the fundamental properties of germanium, such as band offsets, impurities, defects and surface structures, which determine the performance of germanium-based devices in conjunction with conventional silicon technology. The second part covers methods

Low-Power Deep Sub-Micron CMOS Logic

Low-Power Deep Sub-Micron CMOS Logic
  • Author : P. van der Meer,A. van Staveren,Arthur H.M. van Roermund
  • Publisher : Springer Science & Business Media
  • Release : 06 December 2012
GET THIS BOOKLow-Power Deep Sub-Micron CMOS Logic

1. 1 Power-dissipation trends in CMOS circuits Shrinking device geometry, growing chip area and increased data-processing speed performance are technological trends in the integrated circuit industry to enlarge chip functionality. Already in 1965 Gordon Moore predicted that the total number of devices on a chip would double every year until the 1970s and every 24 months in the 1980s. This prediction is widely known as "Moore's Law" and eventually culminated in the Semiconductor Industry Association (SIA) technology road map [1]. The SIA road map has

Stress and Strain Engineering at Nanoscale in Semiconductor Devices

Stress and Strain Engineering at Nanoscale in Semiconductor Devices
  • Author : Chinmay K. Maiti
  • Publisher : CRC Press
  • Release : 30 June 2021
GET THIS BOOKStress and Strain Engineering at Nanoscale in Semiconductor Devices

Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand

On-Wafer Microwave Measurements and De-embedding

On-Wafer Microwave Measurements and De-embedding
  • Author : Errikos Lourandakis
  • Publisher : Artech House
  • Release : 31 July 2016
GET THIS BOOKOn-Wafer Microwave Measurements and De-embedding

This new authoritative resource presents the basics of network analyzer measurement equipment and troubleshooting errors involved in the on-wafer microwave measurement process. This book bridges the gap between theoretical and practical information using real-world practices that address all aspects of on-wafer passive device characterization in the microwave frequency range up to 60GHz. Readers find data and measurements from silicon integrated passive devices fabricated and tested in advance CMOS technologies. Basic circuit equations, terms and fundamentals of time and frequency domain

High Mobility Materials for CMOS Applications

High Mobility Materials for CMOS Applications
  • Author : Nadine Collaert
  • Publisher : Woodhead Publishing
  • Release : 29 June 2018
GET THIS BOOKHigh Mobility Materials for CMOS Applications

High Mobility Materials for CMOS Applications provides a comprehensive overview of recent developments in the field of (Si)Ge and III-V materials and their integration on Si. The book covers material growth and integration on Si, going all the way from device to circuit design. While the book's focus is on digital applications, a number of chapters also address the use of III-V for RF and analog applications, and in optoelectronics. With CMOS technology moving to the 10nm node and

SiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices

SiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices
  • Author : John D. Cressler
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOKSiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices

What seems routine today was not always so. The field of Si-based heterostructures rests solidly on the shoulders of materials scientists and crystal growers, those purveyors of the semiconductor “black arts” associated with the deposition of pristine films of nanoscale dimensionality onto enormous Si wafers with near infinite precision. We can now grow near-defect free, nanoscale films of Si and SiGe strained-layer epitaxy compatible with conventional high-volume silicon integrated circuit manufacturing. SiGe and Si Strained-Layer Epitaxy for Silicon Heterostructure Devices

Silicon Heterostructure Handbook

Silicon Heterostructure Handbook
  • Author : John D. Cressler
  • Publisher : CRC Press
  • Release : 03 October 2018
GET THIS BOOKSilicon Heterostructure Handbook

An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of functions, unprecedented levels of performance, and low manufacturing costs. While there are many books on specific aspects of Si heterostructures, the Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si Strained-Layer Epitaxy is the first book to bring all aspects together in a single source. Featuring broad, comprehensive, and in-depth discussion, this

Silicon and Silicide Nanowires

Silicon and Silicide Nanowires
  • Author : Yu Huang,King-Ning Tu
  • Publisher : CRC Press
  • Release : 19 April 2016
GET THIS BOOKSilicon and Silicide Nanowires

Nanoscale materials are showing great promise in various electronic, optoelectronic, and energy applications. Silicon (Si) has especially captured great attention as the leading material for microelectronic and nanoscale device applications. Recently, various silicides have garnered special attention for their pivotal role in Si device engineering and for the vast potential they possess in fields such as thermoelectricity and magnetism. The fundamental understanding of Si and silicide material processes at nanoscale plays a key role in achieving device structures and performance

Past, Present and Future Challenges of Biosensors and Bioanalytical Tools in Analytical Chemistry: A Tribute to Professor Marco Mascini

Past, Present and Future Challenges of Biosensors and Bioanalytical Tools in Analytical Chemistry: A Tribute to Professor Marco Mascini
  • Author : Anonim
  • Publisher : Elsevier
  • Release : 19 August 2017
GET THIS BOOKPast, Present and Future Challenges of Biosensors and Bioanalytical Tools in Analytical Chemistry: A Tribute to Professor Marco Mascini

Past, Present and Future Challenges of Biosensors and Bioanalytical Tools in Analytical Chemistry: A Tribute to Professor Marco Mascini, Volume 77, the newest release in the Comprehensive Analytical Chemistry series, provides an update to topics of interest, with this volume containing chapters on Biosensors and Bioanalytical tools, Enzymes: from bioreceptors in biosensing to power generation for biosensing, Whole-cell biosensors and bioassays, New trends in antibody-based biosensors, Aptamer-based biosensors and bioassays, Biomimetic sensors based on molecularly imprinted interfaces, Nucleic acid in genosensors