Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Produk Detail:

  • Author : Haleh Ardebili
  • Publisher : William Andrew
  • Pages : 508 pages
  • ISBN : 0128119799
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKEncapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
  • Author : Haleh Ardebili,Jiawei Zhang,Michael Pecht
  • Publisher : William Andrew
  • Release : 23 October 2018
GET THIS BOOKEncapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to

Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
  • Author : James J. Licari,Dale W. Swanson
  • Publisher : William Andrew
  • Release : 24 June 2011
GET THIS BOOKAdhesives Technology for Electronic Applications

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework

Processing Technology for Bio-Based Polymers

Processing Technology for Bio-Based Polymers
  • Author : Khalid Mahmood Zia,Nadia Akram,Shazia Tabasum,Aqdas Noreen,Muhammad Usman Akbar
  • Publisher : Elsevier
  • Release : 25 June 2021
GET THIS BOOKProcessing Technology for Bio-Based Polymers

Processing Technology for Bio-Based Polymers: Advanced Strategies and Practical Aspects brings together the latest advances and novel technologies surrounding the synthesis and manufacture of biopolymers, ranging from bio-based polymers to synthetic polymers from bio-derived monomers. Sections examine bio-based polymer chemistry, discuss polymerization process and emerging design technologies, cover manufacturing and processing approaches, explain cutting-edge approaches and innovative applications, and focus on biomedicals and other key application areas. Final chapters provide detailed discussion and an analysis of economic and environmental concerns,

Implantable Sensor Systems for Medical Applications

Implantable Sensor Systems for Medical Applications
  • Author : Andreas Inmann,Diana Hodgins
  • Publisher : Elsevier
  • Release : 02 January 2013
GET THIS BOOKImplantable Sensor Systems for Medical Applications

Implantable sensor systems offer great potential for enhanced medical care and improved quality of life, consequently leading to major investment in this exciting field. Implantable sensor systems for medical applications provides a wide-ranging overview of the core technologies, key challenges and main issues related to the development and use of these devices in a diverse range of medical applications. Part one reviews the fundamentals of implantable systems, including materials and material-tissue interfaces, packaging and coatings, microassembly, electrode array design and

Handbook of Polymers for Electronics

Handbook of Polymers for Electronics
  • Author : George Wypych
  • Publisher : Elsevier
  • Release : 31 January 2021
GET THIS BOOKHandbook of Polymers for Electronics

Polymers used in electronics and electrical engineering are essential to the development of high-tech products, with applications in space, aviation, health, automotive, communication, robotics, consumer products, and beyond. Typical features of mainstream polymers such as mechanical performance, optical behavior, and environmental stability frequently need to be enhanced to perform in these demanding applications, creating the need to develop special grades or use completely new chemistry for their synthesis. Similarly, the typical set of properties included in the description of mainstream

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
  • Author : Anonim
  • Publisher : World Scientific
  • Release : 27 August 2019
GET THIS BOOKEncyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the

Electronic Enclosures, Housings and Packages

Electronic Enclosures, Housings and Packages
  • Author : Frank Suli
  • Publisher : Woodhead Publishing
  • Release : 15 November 2018
GET THIS BOOKElectronic Enclosures, Housings and Packages

Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and

Microbial Cultures and Enzymes in Dairy Technology

Microbial Cultures and Enzymes in Dairy Technology
  • Author : Öztürko?lu Budak, ?ebnem,Akal, H. Ceren
  • Publisher : IGI Global
  • Release : 27 April 2018
GET THIS BOOKMicrobial Cultures and Enzymes in Dairy Technology

Microorganisms are an integral part of the fermentation process in food products and help to improve sensory and textural properties of the products. As such, it is vital to explore the current uses of microorganisms in the dairy industry. Microbial Cultures and Enzymes in Dairy Technology is a critical scholarly resource that explores multidisciplinary uses of cultures and enzymes in the production of dairy products. Featuring coverage on a wide range of topics such as dairy probiotics, biopreservatives, and fermentation,

Reliability Technology

Reliability Technology
  • Author : Norman Pascoe
  • Publisher : John Wiley & Sons
  • Release : 08 March 2011
GET THIS BOOKReliability Technology

A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers. This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers? attention is also drawn to the many

Physical Assurance

Physical Assurance
  • Author : Navid Asadizanjani,Mir Tanjidur Rahman,Mark Tehranipoor
  • Publisher : Springer Nature
  • Release : 15 February 2021
GET THIS BOOKPhysical Assurance

This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.

Recycled Plastic Biocomposites

Recycled Plastic Biocomposites
  • Author : Md Rezaur Rahman,Muhammad Khusairy Bin Bakri
  • Publisher : Woodhead Publishing
  • Release : 25 January 2022
GET THIS BOOKRecycled Plastic Biocomposites

Recycled plastic biocomposites have attracted widespread attention from both researchers and manufacturers due to the significant improvements in their physico-mechanical, thermal, rheological, and barrier properties when compared to conventional materials, as well as their potential regarding commercialization and zero waste. Recycled Plastic Biocomposites presents the latest information on recycled polymers, textiles, pulp and paper, wood plastic, rubber waste plastic, and micro and nano effects of recycled plastic waste resources that have great potential as reinforcement materials in composites because they

Encapsulation Technologies and Delivery Systems for Food Ingredients and Nutraceuticals

Encapsulation Technologies and Delivery Systems for Food Ingredients and Nutraceuticals
  • Author : Nissim Garti,D. Julian McClements
  • Publisher : Elsevier
  • Release : 19 October 2012
GET THIS BOOKEncapsulation Technologies and Delivery Systems for Food Ingredients and Nutraceuticals

Improved technologies for the encapsulation, protection, release and enhanced bioavailability of food ingredients and nutraceutical components are vital to the development of future foods. Encapsulation technologies and delivery systems for food ingredients and nutraceuticals provides a comprehensive guide to current and emerging techniques. Part one provides an overview of key requirements for food ingredient and nutraceutical delivery systems, discussing challenges in system development and analysis of interaction with the human gastrointestinal tract. Processing technologies for encapsulation and delivery systems are

Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies

Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies
  • Author : Kenichi Takahata
  • Publisher : BoD – Books on Demand
  • Release : 29 May 2013
GET THIS BOOKAdvances in Micro/Nano Electromechanical Systems and Fabrication Technologies

MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these

Polymers for Electronic & Photonic Application

Polymers for Electronic & Photonic Application
  • Author : C. P. Wong
  • Publisher : Elsevier
  • Release : 22 October 2013
GET THIS BOOKPolymers for Electronic & Photonic Application

The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This book provides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging, electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacture microelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to

Printed Electronics

Printed Electronics
  • Author : Zheng Cui
  • Publisher : John Wiley & Sons
  • Release : 26 September 2016
GET THIS BOOKPrinted Electronics

This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support