Fully Depleted Silicon On Insulators

Fully Depleted Silicon-On-Insulators: FD-SOI Devices, Mechanisms and Characterization Techniques presents an in-depth introduction to the key concepts of this increasingly important advanced technology. There are two main technologies in the marketplace of advanced CMOS circuits: FinFETs and Fully depleted silicon-on-insulators (FD-SOI). The latter is unchallenged in the field of low-power, high-frequency and internet-of-things (IOT) circuits. The topic is very timely at research and development levels. Compared to existing books on silicon-on-insulator materials and devices, this book will cover exhaustively the FD-SOI domain. Fully Depleted Silicon-On-Insulators: FD-SOI Devices, Mechanisms and Characterization Techniques is based on the expertise of one of the most eminent individuals in the community, Dr. Sorin Cristoloveanue, an IEEE Andrew Grove 2017 award recipient for "For contributions to silicon-on-insulator technology and thin body devices.” In the book, he shares key insights on the technology aspects, operation mechanisms, characterization techniques and most promising emerging applications. Written by a top expert in the silicon-on-insulator community and IEEE Andrew Grove 2017 award recipient Comprehensively addresses the technology aspects, operation mechanisms and electrical characterization techniques for FD-SOI devices Discusses FD-SOI's most promising device structures for memory, sensing, and emerging applications

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  • Author : Sorin Cristoloveanu
  • Publisher : Elsevier
  • Pages : 425 pages
  • ISBN : 9780128196434
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKFully Depleted Silicon On Insulators

Fully Depleted Silicon-On-Insulators

Fully Depleted Silicon-On-Insulators
  • Author : Sorin Cristoloveanu
  • Publisher : Elsevier
  • Release : 15 July 2021
GET THIS BOOKFully Depleted Silicon-On-Insulators

Fully Depleted Silicon-On-Insulators: FD-SOI Devices, Mechanisms and Characterization Techniques presents an in-depth introduction to the key concepts of this increasingly important advanced technology. There are two main technologies in the marketplace of advanced CMOS circuits: FinFETs and Fully depleted silicon-on-insulators (FD-SOI). The latter is unchallenged in the field of low-power, high-frequency and internet-of-things (IOT) circuits. The topic is very timely at research and development levels. Compared to existing books on silicon-on-insulator materials and devices, this book will cover exhaustively the

Silicon-On-Insulator (SOI) Technology

Silicon-On-Insulator (SOI) Technology
  • Author : O. Kononchuk,B.-Y. Nguyen
  • Publisher : Elsevier
  • Release : 19 June 2014
GET THIS BOOKSilicon-On-Insulator (SOI) Technology

Silicon-On-Insulator (SOI) Technology: Manufacture and Applications covers SOI transistors and circuits, manufacture, and reliability. The book also looks at applications such as memory, power devices, and photonics. The book is divided into two parts; part one covers SOI materials and manufacture, while part two covers SOI devices and applications. The book begins with chapters that introduce techniques for manufacturing SOI wafer technology, the electrical properties of advanced SOI materials, and modeling short-channel SOI semiconductor transistors. Both partially depleted and fully

Silicon-on-Insulator Technology: Materials to VLSI

Silicon-on-Insulator Technology: Materials to VLSI
  • Author : J.-P. Colinge
  • Publisher : Springer Science & Business Media
  • Release : 29 February 2004
GET THIS BOOKSilicon-on-Insulator Technology: Materials to VLSI

Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a

CMOS VLSI Engineering

CMOS VLSI Engineering
  • Author : James B. Kuo,Ker-Wei Su
  • Publisher : Springer Science & Business Media
  • Release : 17 April 2013
GET THIS BOOKCMOS VLSI Engineering

Silicon-On-Insulator (SOI) CMOS technology has been regarded as another major technology for VLSI in addition to bulk CMOS technology. Owing to the buried oxide structure, SOI technology offers superior CMOS devices with higher speed, high density, and reduced second order effects for deep-submicron low-voltage, low-power VLSI circuits applications. In addition to VLSI applications, and because of its outstanding properties, SOI technology has been used to realize communication circuits, microwave devices, BICMOS devices, and even fiber optics applications. CMOS VLSI Engineering:

Integration of Single Photon Avalanche Diodes in Fully Depleted Silicon-on-Insulator Technology

Integration of Single Photon Avalanche Diodes in Fully Depleted Silicon-on-Insulator Technology
  • Author : Tulio Chaves De Albuquerque
  • Publisher : Unknown Publisher
  • Release : 07 March 2021
GET THIS BOOKIntegration of Single Photon Avalanche Diodes in Fully Depleted Silicon-on-Insulator Technology

This work aims at the design, simulation, modelling and electrical characterization of Single Photon Avalanche Diodes (SPAD) in an advanced Fully Depleted Silicon on Insulator (FDSOI) technology. SPADs are PN junctions reversed bias above breakdown voltage, operating in the so-called Geiger mode. Such an implementation should provide an intrinsic monolithic integration of those devices, along with their mandatory associated electronics, thanks to the buried oxide layer present in that technology, optimizing fill factor. Due to its high sensitivity, SPAD are

Fully-Depleted SOI CMOS Circuits and Technology for Ultralow-Power Applications

Fully-Depleted SOI CMOS Circuits and Technology for Ultralow-Power Applications
  • Author : Takayasu Sakurai,Akira Matsuzawa,Takakuni Douseki
  • Publisher : Springer Science & Business Media
  • Release : 01 February 2007
GET THIS BOOKFully-Depleted SOI CMOS Circuits and Technology for Ultralow-Power Applications

Fully-depleted SOI CMOS Circuits and Technology for Ultralow-Power Applications addresses the problem of reducing the supply voltage of conventional circuits for ultralow-power operation and explains power-efficient MTCMOS circuit design for FD-SOI devices at a supply voltage of 0.5 V. The topics include the minimum required knowledge of the fabrication of SOI substrates; FD-SOI devices and the latest developments in device and process technologies; and ultralow-voltage circuits, such as digital circuits, analog/RF circuits, and DC-DC converters. Each ultra-low-power technique related to

Electrical Characterization of Silicon-on-Insulator Materials and Devices

Electrical Characterization of Silicon-on-Insulator Materials and Devices
  • Author : Sorin Cristoloveanu,Sheng Li
  • Publisher : Springer Science & Business Media
  • Release : 30 June 1995
GET THIS BOOKElectrical Characterization of Silicon-on-Insulator Materials and Devices

Silicon on Insulator is more than a technology, more than a job, and more than a venture in microelectronics; it is something different and refreshing in device physics. This book recalls the activity and enthu siasm of our SOl groups. Many contributing students have since then disappeared from the SOl horizon. Some of them believed that SOl was the great love of their scientific lives; others just considered SOl as a fantastic LEGO game for adults. We thank them all

Noise in Nanoscale Semiconductor Devices

Noise in Nanoscale Semiconductor Devices
  • Author : Tibor Grasser
  • Publisher : Springer Nature
  • Release : 26 April 2020
GET THIS BOOKNoise in Nanoscale Semiconductor Devices

This book summarizes the state-of-the-art, regarding noise in nanometer semiconductor devices. Readers will benefit from this leading-edge research, aimed at increasing reliability based on physical microscopic models. Authors discuss the most recent developments in the understanding of point defects, e.g. via ab initio calculations or intricate measurements, which have paved the way to more physics-based noise models which are applicable to a wider range of materials and features, e.g. III-V materials, 2D materials, and multi-state defects. Describes the

Silicon-on-Insulator Technology and Devices 13

Silicon-on-Insulator Technology and Devices 13
  • Author : George K. Celler,Sorin Cristoloveanu
  • Publisher : The Electrochemical Society
  • Release : 01 January 2007
GET THIS BOOKSilicon-on-Insulator Technology and Devices 13

This issue of ESC Transactions covers recent significant advances in SOI technologies. It will be of interest to materials and device scientists, as well as to process and applications oriented engineers. Several keynote papers introduce and review the main topics. This is followed by contributed papers covering the latest research and implementation results.

Low-Power CMOS Circuits

Low-Power CMOS Circuits
  • Author : Christian Piguet
  • Publisher : CRC Press
  • Release : 03 October 2018
GET THIS BOOKLow-Power CMOS Circuits

The power consumption of microprocessors is one of the most important challenges of high-performance chips and portable devices. In chapters drawn from Piguet's recently published Low-Power Electronics Design, Low-Power CMOS Circuits: Technology, Logic Design, and CAD Tools addresses the design of low-power circuitry in deep submicron technologies. It provides a focused reference for specialists involved in designing low-power circuitry, from transistors to logic gates. The book is organized into three broad sections for convenient access. The first examines the history

The Fourth Terminal

The Fourth Terminal
  • Author : Sylvain Clerc,Thierry Di Gilio,Andreia Cathelin
  • Publisher : Springer Nature
  • Release : 25 April 2020
GET THIS BOOKThe Fourth Terminal

This book discusses the advantages and challenges of Body-Biasing for integrated circuits and systems, together with the deployment of the design infrastructure needed to generate this Body-Bias voltage. These new design solutions enable state of the art energy efficiency and system flexibility for the latest applications, such as Internet of Things and 5G communications.

Wafer Bonding

Wafer Bonding
  • Author : Marin Alexe,Ulrich Gösele
  • Publisher : Springer Science & Business Media
  • Release : 09 March 2013
GET THIS BOOKWafer Bonding

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.