Handbook of Silicon Wafer Cleaning Technology

Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process

Produk Detail:

  • Author : Karen Reinhardt
  • Publisher : William Andrew
  • Pages : 760 pages
  • ISBN : 032351085X
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKHandbook of Silicon Wafer Cleaning Technology

Handbook of Silicon Wafer Cleaning Technology

Handbook of Silicon Wafer Cleaning Technology
  • Author : Karen Reinhardt,Werner Kern
  • Publisher : William Andrew
  • Release : 16 March 2018
GET THIS BOOKHandbook of Silicon Wafer Cleaning Technology

Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning.

Handbook of Silicon Wafer Cleaning Technology, 2nd Edition

Handbook of Silicon Wafer Cleaning Technology, 2nd Edition
  • Author : Karen Reinhardt,Werner Kern
  • Publisher : William Andrew
  • Release : 10 December 2008
GET THIS BOOKHandbook of Silicon Wafer Cleaning Technology, 2nd Edition

The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both

Handbook of Semiconductor Wafer Cleaning Technology

Handbook of Semiconductor Wafer Cleaning Technology
  • Author : Werner Kern
  • Publisher : William Andrew
  • Release : 09 August 1993
GET THIS BOOKHandbook of Semiconductor Wafer Cleaning Technology

"The cleaning of semiconductor wafers has become one of the most critical operations in the fabrication of semiconductor devices. The considerable body of technical and scientific literature is widely dispersed in numerous journals and symposia proceedings. This book brings together in one volume all pertinent knowledge on semiconductor wafer cleaning and its associated scientific and technical disciplines. It provides the first comprehensive and up-to-date coverage of this rapidly evolving field. Its thirteen chapters were written by nineteen scientists who are

Handbook for Cleaning for Semiconductor Manufacturing

Handbook for Cleaning for Semiconductor Manufacturing
  • Author : Karen A. Reinhardt,Richard F. Reidy
  • Publisher : John Wiley & Sons
  • Release : 12 April 2011
GET THIS BOOKHandbook for Cleaning for Semiconductor Manufacturing

This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive

Handbook of Silicon Wafer Cleaning Technology, 2nd Edition

Handbook of Silicon Wafer Cleaning Technology, 2nd Edition
  • Author : Karen Reinhardt,Werner Kern
  • Publisher : William Andrew
  • Release : 10 December 2008
GET THIS BOOKHandbook of Silicon Wafer Cleaning Technology, 2nd Edition

The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both

Handbook for Cleaning for Semiconductor Manufacturing

Handbook for Cleaning for Semiconductor Manufacturing
  • Author : Karen A. Reinhardt,Richard F. Reidy
  • Publisher : Wiley-Scrivener
  • Release : 11 January 2011
GET THIS BOOKHandbook for Cleaning for Semiconductor Manufacturing

This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive

Handbook of Silicon Based MEMS Materials and Technologies

Handbook of Silicon Based MEMS Materials and Technologies
  • Author : Markku Tilli,Mervi Paulasto-Krockel,Teruaki Motooka,Veikko Lindroos
  • Publisher : William Andrew
  • Release : 02 September 2015
GET THIS BOOKHandbook of Silicon Based MEMS Materials and Technologies

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS

Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques

Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques
  • Author : Rajiv Kohli,K.L. Mittal
  • Publisher : Elsevier
  • Release : 27 November 2018
GET THIS BOOKDevelopments in Surface Contamination and Cleaning: Applications of Cleaning Techniques

Developments in Surface Contamination and Cleaning: Applications of Cleaning Techniques, Volume Eleven, part of the Developments in Surface Contamination and Cleaning series, provides a guide to recent advances in the application of cleaning techniques for the removal of surface contamination in various industries, such as aerospace, automotive, biomedical, defense, energy, manufacturing, microelectronics, optics and xerography. The material in this new edition compiles cleaning applications into one easy reference that has been fully updated to incorporate new applications and techniques. Taken

Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning

Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning
  • Author : Rajiv Kohli,Kashmiri L. Mittal
  • Publisher : William Andrew
  • Release : 04 November 2016
GET THIS BOOKDevelopments in Surface Contamination and Cleaning: Methods for Surface Cleaning

Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning, Volume 9, part of the Developments in Surface Contamination and Cleaning series provide a state-of-the-art guide to the current knowledge on the behavior of film-type and particulate surface contaminants and their associated cleaning methods. This newest volume in the series discusses methods of surface cleaning of contaminants and the resources that are needed to deal with them. Taken as a whole, the series forms a unique reference for professionals and academics

Developments in Surface Contamination and Cleaning, Volume 8

Developments in Surface Contamination and Cleaning, Volume 8
  • Author : Rajiv Kohli,Kashmiri L. Mittal
  • Publisher : William Andrew
  • Release : 03 June 2015
GET THIS BOOKDevelopments in Surface Contamination and Cleaning, Volume 8

As device sizes in the semiconductor industries shrink, devices become more vulnerable to smaller contaminant particles, and most conventional cleaning techniques employed in the industry are not effective at smaller scales. The book series Developments in Surface Contamination and Cleaning as a whole provides an excellent source of information on these alternative cleaning techniques as well as methods for characterization and validation of surface contamination. Each volume has a particular topical focus, covering the key techniques and recent developments in

Semiconductors

Semiconductors
  • Author : Martin I. Pech-Canul,Nuggehalli M. Ravindra
  • Publisher : Springer
  • Release : 17 January 2019
GET THIS BOOKSemiconductors

This book is a practical guide to optical, optoelectronic, and semiconductor materials and provides an overview of the topic from its fundamentals to cutting-edge processing routes to groundbreaking technologies for the most recent applications. The book details the characterization and properties of these materials. Chemical methods of synthesis are emphasized by the authors throughout the publication. Describes new materials and updates to older materials that exhibit optical, optoelectronic and semiconductor behaviors; Covers the structural and mechanical aspects of the optical,

Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 24 September 2021
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric