Hermeticity of Electronic Packages

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package�especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise. The book gathers in a single volume a great many issues previously available only in journals�or only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.

Produk Detail:

  • Author : Hal Greenhouse
  • Publisher : William Andrew
  • Pages : 348 pages
  • ISBN : 1437778771
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKHermeticity of Electronic Packages

Hermeticity of Electronic Packages

Hermeticity of Electronic Packages
  • Author : Hal Greenhouse
  • Publisher : William Andrew
  • Release : 01 July 2022
GET THIS BOOKHermeticity of Electronic Packages

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package�especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience,

Hermeticity of Electronic Packages

Hermeticity of Electronic Packages
  • Author : Hal Greenhouse
  • Publisher : Unknown Publisher
  • Release : 01 July 2022
GET THIS BOOKHermeticity of Electronic Packages

Provides background and problem-solving examples applicable to package designers, package users, reliability engineers, and those who measure and evaluate the integrity of packages to apply this knowledge to solving their specific challenges. Attempts to answer the following questions: how do you define the goodness of the seal? how is that seal measured? how does the integrity of the seal effect circuit reliability? Includes more than 100 application-specific problems and their solutions.

Hermeticity Testing of MEMS and Microelectronic Packages

Hermeticity Testing of MEMS and Microelectronic Packages
  • Author : Suzanne Costello,Marc P.Y. Desmulliez
  • Publisher : Artech House
  • Release : 01 October 2013
GET THIS BOOKHermeticity Testing of MEMS and Microelectronic Packages

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test

Handbook of Electronic Package Design

Handbook of Electronic Package Design
  • Author : Michael Pecht
  • Publisher : CRC Press
  • Release : 24 October 2018
GET THIS BOOKHandbook of Electronic Package Design

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Handbook of Silicon Based MEMS Materials and Technologies

Handbook of Silicon Based MEMS Materials and Technologies
  • Author : Markku Tilli,Mervi Paulasto-Krockel,Teruaki Motooka,Veikko Lindroos
  • Publisher : William Andrew
  • Release : 02 September 2015
GET THIS BOOKHandbook of Silicon Based MEMS Materials and Technologies

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
  • Author : Haleh Ardebili,Jiawei Zhang,Michael Pecht
  • Publisher : William Andrew
  • Release : 23 October 2018
GET THIS BOOKEncapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to

Advanced RF MEMS

Advanced RF MEMS
  • Author : Stepan Lucyszyn
  • Publisher : Cambridge University Press
  • Release : 19 August 2010
GET THIS BOOKAdvanced RF MEMS

An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying

Industrial Applications of Lasers

Industrial Applications of Lasers
  • Author : John F. Ready
  • Publisher : Elsevier
  • Release : 25 April 1997
GET THIS BOOKIndustrial Applications of Lasers

A practical book with a variety of uses, this book can help applications engineers spark problem-solving techniques through the use of lasers. Industrial Application of Lasers, Second Edition takes the reader through laser fundamentals, unusual properties of laser light, types of practical lasers available, and commonly used accessory equipment. The book also applies this information to existing and developing applications. Current uses of lasers, including laser welding and cutting, electronic fabrication techniques, lightwave communications, laser-based applications in alignment, surveying, and

Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging
  • Author : Xingcun Colin Tong
  • Publisher : Springer Science & Business Media
  • Release : 05 January 2011
GET THIS BOOKAdvanced Materials for Thermal Management of Electronic Packaging

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining

Mechanical Analysis of Electronic Packaging Systems

Mechanical Analysis of Electronic Packaging Systems
  • Author : Mckeown
  • Publisher : CRC Press
  • Release : 06 April 1999
GET THIS BOOKMechanical Analysis of Electronic Packaging Systems

"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."

Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties
  • Author : Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOKElectronic Packaging Materials and Their Properties

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

Electronic Materials Handbook

Electronic Materials Handbook
  • Author : Anonim
  • Publisher : ASM International
  • Release : 01 November 1989
GET THIS BOOKElectronic Materials Handbook

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook,