Microjoining and Nanojoining

Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells. This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microwelding Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells

Produk Detail:

  • Author : Y N Zhou
  • Publisher : Elsevier
  • Pages : 832 pages
  • ISBN : 184569404X
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKMicrojoining and Nanojoining

Microjoining and Nanojoining

Microjoining and Nanojoining
  • Author : Y N Zhou
  • Publisher : Elsevier
  • Release : 27 March 2008
GET THIS BOOKMicrojoining and Nanojoining

Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and

Joining Processes for Dissimilar and Advanced Materials

Joining Processes for Dissimilar and Advanced Materials
  • Author : Pawan Kumar Rakesh,J. Paulo Davim
  • Publisher : Woodhead Publishing
  • Release : 13 November 2021
GET THIS BOOKJoining Processes for Dissimilar and Advanced Materials

Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the

Solid-State Hydrogen Storage

Solid-State Hydrogen Storage
  • Author : Gavin Walker
  • Publisher : Elsevier
  • Release : 30 September 2008
GET THIS BOOKSolid-State Hydrogen Storage

Hydrogen fuel cells are emerging as a major alternative energy source in transportation and other applications. Central to the development of the hydrogen economy is safe, efficient and viable storage of hydrogen. Solid-state hydrogen storage: Materials and chemistry reviews the latest developments in solid-state hydrogen storage. Part one discusses hydrogen storage technologies, hydrogen futures, hydrogen containment materials and solid-state hydrogen storage system design. Part two reviews the analysis of hydrogen interactions including structural characterisation of hydride materials, neutron scattering techniques,

Advanced Piezoelectric Materials

Advanced Piezoelectric Materials
  • Author : Kenji Uchino
  • Publisher : Elsevier
  • Release : 27 September 2010
GET THIS BOOKAdvanced Piezoelectric Materials

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and

Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
  • Author : M O Alam,C Bailey
  • Publisher : Elsevier
  • Release : 25 May 2011
GET THIS BOOKAdvanced Adhesives in Electronics

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part

Nano-Bio- Electronic, Photonic and MEMS Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging
  • Author : C.P. Wong,Kyoung-Sik Moon,Yi (Grace) Li
  • Publisher : Springer Science & Business Media
  • Release : 23 December 2009
GET THIS BOOKNano-Bio- Electronic, Photonic and MEMS Packaging

Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.

Nano-Bio- Electronic, Photonic and MEMS Packaging

Nano-Bio- Electronic, Photonic and MEMS Packaging
  • Author : C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi Li
  • Publisher : Springer Nature
  • Release : 17 October 2020
GET THIS BOOKNano-Bio- Electronic, Photonic and MEMS Packaging

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources,

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)
  • Author : Anonim
  • Publisher : World Scientific
  • Release : 27 August 2019
GET THIS BOOKEncyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the

Handbook of Laser Welding Technologies

Handbook of Laser Welding Technologies
  • Author : S Katayama
  • Publisher : Elsevier
  • Release : 30 June 2013
GET THIS BOOKHandbook of Laser Welding Technologies

Laser welding is a rapidly developing and versatile technology which has found increasing applications in industry and manufacturing. It allows the precision welding of small and hard-to-reach areas, and is particularly suitable for operation under computer or robotic control. The Handbook of laser welding technologies reviews the latest developments in the field and how they can be used across a variety of applications. Part one provides an introduction to the fundamentals of laser welding before moving on to explore developments

Joining and Assembly of Medical Materials and Devices

Joining and Assembly of Medical Materials and Devices
  • Author : Y N Zhou,M D Breyen
  • Publisher : Elsevier
  • Release : 31 May 2013
GET THIS BOOKJoining and Assembly of Medical Materials and Devices

As medical devices become more intricate, with an increasing number of components made from a wide range of materials, it is important that they meet stringent requirements to ensure that they are safe to be implanted and will not be rejected by the human body. Joining and assembly of medical materials and devices provides a comprehensive overview of joining techniques for a range of medical materials and applications. Part one provides an introduction to medical devices and joining methods with

Fracture, Fatigue, Failure and Damage Evolution, Volume 7

Fracture, Fatigue, Failure and Damage Evolution, Volume 7
  • Author : Jay Carroll,Shuman Xia,Alison M. Beese,Ryan B. Berke,Garrett J Pataky
  • Publisher : Springer
  • Release : 24 August 2017
GET THIS BOOKFracture, Fatigue, Failure and Damage Evolution, Volume 7

Fracture, Fatigue, Failure and Damage Evolution, Volume 7 of the Proceedings of the 2017 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of nine from the Conference, brings together contributions to this important area of research and engineering. Session organizers include: Jay Carroll, Shuman Xia, Allison Beese, Ryan Berke, Garrett Pataky, Samantha Daly, Kavan Hazeli, Antonios Kontsos, Omer Ozgur Capraz, Scott Grutzik, Onome Scott-Emaukpor The collection presents early findings and case studies on a wide range of areas,

Implantable Sensor Systems for Medical Applications

Implantable Sensor Systems for Medical Applications
  • Author : Andreas Inmann,Diana Hodgins
  • Publisher : Elsevier
  • Release : 02 January 2013
GET THIS BOOKImplantable Sensor Systems for Medical Applications

Implantable sensor systems offer great potential for enhanced medical care and improved quality of life, consequently leading to major investment in this exciting field. Implantable sensor systems for medical applications provides a wide-ranging overview of the core technologies, key challenges and main issues related to the development and use of these devices in a diverse range of medical applications. Part one reviews the fundamentals of implantable systems, including materials and material-tissue interfaces, packaging and coatings, microassembly, electrode array design and

Micro and Precision Manufacturing

Micro and Precision Manufacturing
  • Author : Kapil Gupta
  • Publisher : Springer
  • Release : 15 October 2017
GET THIS BOOKMicro and Precision Manufacturing

This book provides details on various micro and precision manufacturing and finishing operations performed by conventional and advanced processes, including micro-manufacturing of micro-tools and precision finishing of engineered components. It describes the process mechanism, principles and parameters while performing micro-fabrication and precision finishing operations. The text provides the readers with knowledge of micro and precision manufacturing and encourages them to explore the future venues in this field.

Ecological Design of Smart Home Networks

Ecological Design of Smart Home Networks
  • Author : N. Saito,D Menga
  • Publisher : Elsevier
  • Release : 31 March 2015
GET THIS BOOKEcological Design of Smart Home Networks

This book provides an authoritative guide for postgraduate students and academic researchers in electronics, computer and network engineering, telecommunications, energy technology and home automation, as well as R&D managers in industrial sectors such as wireless technology, consumer electronics, telecommunications and networking, information technology, energy technology and home automation. Part One outlines the key principles and technologies needed for ecological smart home networks. Beginning with a thorough overview of the concept behind ecological smart home network design, the book reviews

The Welding Engineer’s Guide to Fracture and Fatigue

The Welding Engineer’s Guide to Fracture and Fatigue
  • Author : Philippa L Moore,Geoff Booth
  • Publisher : Elsevier
  • Release : 21 November 2014
GET THIS BOOKThe Welding Engineer’s Guide to Fracture and Fatigue

The Welding Engineer's Guide to Fracture and Fatigue provides an essential introduction to fracture and fatigue and the assessment of these failure modes, through to the level of knowledge that would be expected of a qualified welding engineer. Part one covers the basic principles of weld fracture and fatigue. It begins with a review of the design of engineered structures, provides descriptions of typical welding defects and how these defects behave in structures undergoing static and cyclical loading, and explains