Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

Produk Detail:

  • Author : Hengyun Zhang
  • Publisher : Woodhead Publishing
  • Pages : 434 pages
  • ISBN : 0081025335
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKModeling Analysis Design and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
  • Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
  • Publisher : Woodhead Publishing
  • Release : 22 November 2019
GET THIS BOOKModeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore
  • Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
  • Publisher : Woodhead Publishing
  • Release : 15 September 2019
GET THIS BOOKModeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore

Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.

Advances in Robotics, Automation and Data Analytics

Advances in Robotics, Automation and Data Analytics
  • Author : Jessnor Arif Mat Jizat,Ismail Mohd Khairuddin,Mohd Azraai Mohd Razman,Ahmad Fakhri Ab. Nasir,Mohamad Shaiful Abdul Karim,Abdul Aziz Jaafar,Lim Wei Hong,Anwar P. P. Abdul Majeed,Pengcheng Liu,Hyun Myung,Han-Lim Choi,Gian-Antonio Susto
  • Publisher : Springer Nature
  • Release : 10 March 2021
GET THIS BOOKAdvances in Robotics, Automation and Data Analytics

This book presents essentially a collection of proceedings that deliberate on the key challenges and recent trends on robotics, automation and data analytics which are the pillars of Industry 4.0. Solutions that are employed in the multitude spectra of innovative robotics & automation and data analytics are discussed. The readers are expected to gain an insightful view on the current trends, issues, mitigating factors as well as solutions from the book. This book consists of selected papers presented at the 2nd International

Springer Handbook of Experimental Solid Mechanics

Springer Handbook of Experimental Solid Mechanics
  • Author : William N. Sharpe
  • Publisher : Springer Science & Business Media
  • Release : 04 December 2008
GET THIS BOOKSpringer Handbook of Experimental Solid Mechanics

As a reference book, the Springer Handbook provides a comprehensive exposition of the techniques and tools of experimental mechanics. An informative introduction to each topic is provided, which advises the reader on suitable techniques for practical applications. New topics include biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Written and compiled by internationally renowned experts in the field, this book is a timely, updated reference for both practitioners and researchers

Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques

Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques
  • Author : Wynand Lambrechts,Saurabh Sinha,Jassem Ahmed Abdallah,Jaco Prinsloo
  • Publisher : CRC Press
  • Release : 13 September 2018
GET THIS BOOKExtending Moore's Law through Advanced Semiconductor Design and Processing Techniques

This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics.

Power Electronics Step-by-Step: Design, Modeling, Simulation, and Control

Power Electronics Step-by-Step: Design, Modeling, Simulation, and Control
  • Author : Weidong Xiao
  • Publisher : McGraw Hill Professional
  • Release : 05 February 2021
GET THIS BOOKPower Electronics Step-by-Step: Design, Modeling, Simulation, and Control

Explore the latest power electronics principles, practices, and applications This electrical engineering guide offers comprehensive coverage of design, modeling, simulation, and control for power electronics. The book describes real-world applications for the technology and features case studies worked out in both MATLAB and Simulink. Presented in an accessible style, Power Electronics Step-by-Step: Design, Modeling, Simulation, and Control focuses on the latest technologies, such as DC-based systems, and emphasizes the averaging technique for both simulation and modeling. You will get photos,

Standard Methods for the Examination of Water and Wastewater

Standard Methods for the Examination of Water and Wastewater
  • Author : American Public Health Association
  • Publisher : Unknown Publisher
  • Release : 25 January 2022
GET THIS BOOKStandard Methods for the Examination of Water and Wastewater

"The signature undertaking of the Twenty-Second Edition was clarifying the QC practices necessary to perform the methods in this manual. Section in Part 1000 were rewritten, and detailed QC sections were added in Parts 2000 through 7000. These changes are a direct and necessary result of the mandate to stay abreast of regulatory requirements and a policy intended to clarify the QC steps considered to be an integral part of each test method. Additional QC steps were added to almost half of the

Semiconductor Packaging

Semiconductor Packaging
  • Author : Andrea Chen,Randy Hsiao-Yu Lo
  • Publisher : CRC Press
  • Release : 19 April 2016
GET THIS BOOKSemiconductor Packaging

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means

Op Amps for Everyone

Op Amps for Everyone
  • Author : Ron Mancini
  • Publisher : Newnes
  • Release : 25 January 2022
GET THIS BOOKOp Amps for Everyone

The operational amplifier ("op amp") is the most versatile and widely used type of analog IC, used in audio and voltage amplifiers, signal conditioners, signal converters, oscillators, and analog computing systems. Almost every electronic device uses at least one op amp. This book is Texas Instruments' complete professional-level tutorial and reference to operational amplifier theory and applications. Among the topics covered are basic op amp physics (including reviews of current and voltage division, Thevenin's theorem, and transistor models), idealized op

Power Electronic Packaging

Power Electronic Packaging
  • Author : Yong Liu
  • Publisher : Springer Science & Business Media
  • Release : 15 February 2012
GET THIS BOOKPower Electronic Packaging

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC)

Convex Optimization

Convex Optimization
  • Author : Stephen Boyd,Stephen P. Boyd,Lieven Vandenberghe
  • Publisher : Cambridge University Press
  • Release : 08 March 2004
GET THIS BOOKConvex Optimization

A comprehensive introduction to the tools, techniques and applications of convex optimization.

Metrology and Diagnostic Techniques for Nanoelectronics

Metrology and Diagnostic Techniques for Nanoelectronics
  • Author : Zhiyong Ma,David G. Seiler
  • Publisher : CRC Press
  • Release : 27 March 2017
GET THIS BOOKMetrology and Diagnostic Techniques for Nanoelectronics

Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in