Plasma Etching Processes for Interconnect Realization in VLSI

This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions. This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice of copper/low-k interconnect architecture is one of the keys for integrated circuit performance, process manufacturability and scalability. Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dimension and profile control, selectivity) and new emerging challenges (residue formation, dielectric wiggling) are critical points of research in order to control the reliability and reduce defects in interconnects. These issues and potential solutions are illustrated by the authors through different process architectures available in the semiconductor industry (metallic or organic hard mask strategies). Presents the difficulties encountered for interconnect realization in very large-scale integrated (VLSI) circuits Focused on plasma-dielectric surface interaction Helps you further reduce the dielectric constant for the future technological nodes

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  • Author : Nicolas Posseme
  • Publisher : Elsevier
  • Pages : 128 pages
  • ISBN : 0081005903
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKPlasma Etching Processes for Interconnect Realization in VLSI

Plasma Etching Processes for Interconnect Realization in VLSI

Plasma Etching Processes for Interconnect Realization in VLSI
  • Author : Nicolas Posseme
  • Publisher : Elsevier
  • Release : 14 April 2015
GET THIS BOOKPlasma Etching Processes for Interconnect Realization in VLSI

This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions. This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice

Advances in Atomic, Molecular, and Optical Physics

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  • Author : Anonim
  • Publisher : Academic Press
  • Release : 07 June 2017
GET THIS BOOKAdvances in Atomic, Molecular, and Optical Physics

Advances in Atomic, Molecular, and Optical Physics, Volume 66, provides a comprehensive compilation of recent developments in a field that is in a state of rapid growth as new experimental and theoretical techniques are used on many problems, both old and new. Topics covered include related applied areas, such as atmospheric science, astrophysics, surface physics, and laser physics, with timely articles written by distinguished experts that contain relevant review materials and detailed descriptions of important developments in the field. Presents the

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  • Publisher : CRC Press
  • Release : 23 April 2019
GET THIS BOOKLow-Energy Electrons

Low-energy electrons are ubiquitous in nature and play an important role in natural phenomena as well as many potential and current industrial processes. Authored by 16 active researchers, this book describes the fundamental characteristics of low-energy electron–molecule interactions and their role in different fields of science and technology, including plasma processing, nanotechnology, and health care, as well as astro- and atmospheric physics and chemistry. The book is packed with illustrative examples, from both fundamental and application sides, features about 130 figures,

Advanced Interconnects for ULSI Technology

Advanced Interconnects for ULSI Technology
  • Author : Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
  • Publisher : John Wiley & Sons
  • Release : 17 February 2012
GET THIS BOOKAdvanced Interconnects for ULSI Technology

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers

MEMS Materials and Processes Handbook

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  • Author : Reza Ghodssi,Pinyen Lin
  • Publisher : Springer Science & Business Media
  • Release : 18 March 2011
GET THIS BOOKMEMS Materials and Processes Handbook

MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief

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  • Author : Kazuo Nojiri
  • Publisher : Springer
  • Release : 25 October 2014
GET THIS BOOKDry Etching Technology for Semiconductors

This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need