Plasma Etching Processes for Interconnect Realization in VLSI

This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions. This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice of copper/low-k interconnect architecture is one of the keys for integrated circuit performance, process manufacturability and scalability. Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dimension and profile control, selectivity) and new emerging challenges (residue formation, dielectric wiggling) are critical points of research in order to control the reliability and reduce defects in interconnects. These issues and potential solutions are illustrated by the authors through different process architectures available in the semiconductor industry (metallic or organic hard mask strategies). Presents the difficulties encountered for interconnect realization in very large-scale integrated (VLSI) circuits Focused on plasma-dielectric surface interaction Helps you further reduce the dielectric constant for the future technological nodes

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  • Author : Nicolas Posseme
  • Publisher : Elsevier
  • Pages : 128 pages
  • ISBN : 0081005903
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKPlasma Etching Processes for Interconnect Realization in VLSI

Plasma Etching Processes for Interconnect Realization in VLSI

Plasma Etching Processes for Interconnect Realization in VLSI
  • Author : Nicolas Posseme
  • Publisher : Elsevier
  • Release : 14 April 2015
GET THIS BOOKPlasma Etching Processes for Interconnect Realization in VLSI

This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions. This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice

Advances in Atomic, Molecular, and Optical Physics

Advances in Atomic, Molecular, and Optical Physics
  • Author : Anonim
  • Publisher : Academic Press
  • Release : 07 June 2017
GET THIS BOOKAdvances in Atomic, Molecular, and Optical Physics

Advances in Atomic, Molecular, and Optical Physics, Volume 66, provides a comprehensive compilation of recent developments in a field that is in a state of rapid growth as new experimental and theoretical techniques are used on many problems, both old and new. Topics covered include related applied areas, such as atmospheric science, astrophysics, surface physics, and laser physics, with timely articles written by distinguished experts that contain relevant review materials and detailed descriptions of important developments in the field. Presents the

Low-Energy Electrons

Low-Energy Electrons
  • Author : Oddur Ingólfsson
  • Publisher : CRC Press
  • Release : 23 April 2019
GET THIS BOOKLow-Energy Electrons

Low-energy electrons are ubiquitous in nature and play an important role in natural phenomena as well as many potential and current industrial processes. Authored by 16 active researchers, this book describes the fundamental characteristics of low-energy electron–molecule interactions and their role in different fields of science and technology, including plasma processing, nanotechnology, and health care, as well as astro- and atmospheric physics and chemistry. The book is packed with illustrative examples, from both fundamental and application sides, features about 130 figures,

Plasma Etching Processes for CMOS Devices Realization

Plasma Etching Processes for CMOS Devices Realization
  • Author : Nicolas Posseme
  • Publisher : Elsevier
  • Release : 25 January 2017
GET THIS BOOKPlasma Etching Processes for CMOS Devices Realization

Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent. Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age.

Plasma Processing of Materials

Plasma Processing of Materials
  • Author : National Research Council,Division on Engineering and Physical Sciences,Commission on Physical Sciences, Mathematics, and Applications,Board on Physics and Astronomy,Plasma Science Committee,Panel on Plasma Processing of Materials
  • Publisher : National Academies Press
  • Release : 01 February 1991
GET THIS BOOKPlasma Processing of Materials

Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the world--electronics, aerospace, automotive, steel, biomedical, and toxic waste management. This book describes the relationship between plasma processes and the many industrial applications, examines in detail plasma processing in the electronics industry, highlights the scientific foundation underlying this technology, and discusses education issues in this multidisciplinary field. The committee recommends a coordinated, focused, and well-funded research program in this area that involves the university,

Fabrication of Two-dimensional and Three-dimensional Photonic Crystal Devices for Applications in Chip-scale Optical Interconnects

Fabrication of Two-dimensional and Three-dimensional Photonic Crystal Devices for Applications in Chip-scale Optical Interconnects
  • Author : Anonim
  • Publisher : Unknown Publisher
  • Release : 17 September 2021
GET THIS BOOKFabrication of Two-dimensional and Three-dimensional Photonic Crystal Devices for Applications in Chip-scale Optical Interconnects

To date, the realization of chip-scale optical interconnects has been inhibited by the lack of a device technology that can provide optical functionality at a scale commensurate with integrated circuits. To overcome this limitation, I propose the realization of an "optical superhighway" as an alternative interconnect paradigm for next-generation integrated circuits using semiconductor-based photonic-crystal (PhC) devices. PhCs have the potential to be the elementary building blocks of the next generation of opto-electronic devices and integrated circuits. This potential has invigorated