Reflow Soldering Processes and Troubleshooting

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Produk Detail:

  • Author : Ning-Cheng Lee
  • Publisher : Newnes
  • Pages : 270 pages
  • ISBN : 0750672188
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKReflow Soldering Processes and Troubleshooting

Reflow Soldering Processes and Troubleshooting

Reflow Soldering Processes and Troubleshooting
  • Author : Ning-Cheng Lee
  • Publisher : Newnes
  • Release : 01 January 2002
GET THIS BOOKReflow Soldering Processes and Troubleshooting

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical,

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  • Publisher : Elsevier
  • Release : 02 July 2020
GET THIS BOOKReflow Soldering

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  • Publisher : John Wiley & Sons
  • Release : 18 June 1993
GET THIS BOOKSoldering Processes and Equipment

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

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  • Publisher : Springer Science & Business Media
  • Release : 31 January 1994
GET THIS BOOKMechanics of Solder Alloy Interconnects

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

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  • Publisher : CRC Press
  • Release : 11 December 2003
GET THIS BOOKLead-Free Soldering in Electronics

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  • Publisher : Springer Science & Business Media
  • Release : 31 October 1995
GET THIS BOOKSoldering Handbook For Printed Circuits and Surface Mounting

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  • Publisher : Springer Science & Business Media
  • Release : 06 December 2012
GET THIS BOOKSolder Paste in Electronics Packaging

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This

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  • Publisher : Trans Tech Publications Ltd
  • Release : 11 August 2014
GET THIS BOOKAdvanced Manufacturing and Information Engineering, Intelligent Instrumentation and Industry Development

Collection of selected, peer reviewed papers from the 2014 2nd International Conference on Precision Mechanical Instruments and Measurement Technology (ICPMIMT 2014), May 30-31, 2014, Chongqing, China. The 885 papers are grouped as follows: Chapter 1: Mechanics and Dynamics, Applied Mechanics, Advanced Development in Manufacturing and Industry Engineering, Chapter 2: Mechatronics, Automation and Control, Intelligent Algorithms for Automation and Control, Chapter 3: Measurement and Instrumentation, Monitoring, Testing, Detection, Recognition and Identification Technologies, Chapter 4: Power and Electric Research, Electronics and Microelectronics, Embedded and Integrated Systems, Chapter 5: Algorithms, Computation and

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  • Publisher : John Wiley & Sons
  • Release : 17 November 2011
GET THIS BOOKHandbook of Wafer Bonding

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/

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  • Author : Ephraim Suhir,Y.C. Lee,C.P. Wong
  • Publisher : Springer Science & Business Media
  • Release : 26 May 2007
GET THIS BOOKMicro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such

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  • Publisher : CRC Press
  • Release : 27 February 2004
GET THIS BOOKHandbook of Lead-Free Solder Technology for Microelectronic Assemblies

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder

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  • Release : 06 December 2012
GET THIS BOOKCleaning Printed Wiring Assemblies in Today’s Environment

The impetus to create this book originated from several concerns. One of these was the perceived value to the industry of a collection in one volume of a wide range of information pertinent to the reasons and techniques for de fluxing printed wiring assemblies (PWAs). This book is expected to be of use not only to those engaged in the electronics packaging industry but also to those in related fields seeking information concerning viable methods of dealing with one of

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  • Release : 29 March 2011
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Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of

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  • Publisher : CRC Press
  • Release : 26 September 1997
GET THIS BOOKThe Electrical Engineering Handbook,Second Edition

In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers