LED Packaging for Lighting Applications

"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

Produk Detail:

  • Author : Sheng Liu
  • Publisher : John Wiley & Sons
  • Pages : 352 pages
  • ISBN : 0470827831
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKLED Packaging for Lighting Applications

International Conference on Energy and Power Engineering (EPE2014)

International Conference on Energy and Power Engineering (EPE2014)
  • Author : Anonim
  • Publisher : DEStech Publications, Inc
  • Release : 24 June 2014
GET THIS BOOKInternational Conference on Energy and Power Engineering (EPE2014)

The 2014 International Conference on Energy and Power Engineering (EPE2014), will be held on April 26–27, 2014, in Hong Kong, China. The aim of this international convention is to bring together experts and scholars from around the world and offer them a chance to share the latest research results in the field of Energy and Power Engineering. We all know that over the past few decades, a great change has happened in the field of the environment technology, and the science technology is

Thermal Management for LED Applications

Thermal Management for LED Applications
  • Author : Clemens J.M. Lasance,András Poppe
  • Publisher : Springer Science & Business Media
  • Release : 17 September 2013
GET THIS BOOKThermal Management for LED Applications

Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials)

Solid State Lighting Reliability Part 2

Solid State Lighting Reliability Part 2
  • Author : Willem Dirk van Driel,Xuejun Fan,Guo Qi Zhang
  • Publisher : Springer
  • Release : 13 August 2017
GET THIS BOOKSolid State Lighting Reliability Part 2

In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and

Solid State Lighting Reliability

Solid State Lighting Reliability
  • Author : W.D. van Driel,X.J. Fan
  • Publisher : Springer Science & Business Media
  • Release : 06 September 2012
GET THIS BOOKSolid State Lighting Reliability

Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects
  • Author : John Lau
  • Publisher : McGraw Hill Professional
  • Release : 22 October 2010
GET THIS BOOKReliability of RoHS-Compliant 2D and 3D IC Interconnects

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects

Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly
  • Author : Sheng Liu,Yong Liu
  • Publisher : John Wiley & Sons
  • Release : 24 August 2011
GET THIS BOOKModeling and Simulation for Microelectronic Packaging Assembly

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances

Analysis of Solder Joint Reliability of High Power LEDs by Transient Thermal Testing and Transient Finite Element Simulations

Analysis of Solder Joint Reliability of High Power LEDs by Transient Thermal Testing and Transient Finite Element Simulations
  • Author : Anonim
  • Publisher : Unknown Publisher
  • Release : 22 January 2021
GET THIS BOOKAnalysis of Solder Joint Reliability of High Power LEDs by Transient Thermal Testing and Transient Finite Element Simulations

Abstract: An innovative sensitive test method is developed to detect solder joint cracking for high power LED packages. The method is based on transient thermal analysis and can fully replace the still dominating light-on test. For experimental application of the model, test groups of LED packages were soldered with two different lead free solders (SnAgCu305 and Innolot FL-640) on Aluminum Insulated Metal Substrate (Al-IMS) and exposed to temperature cycles. Transient thermal measurements were performed directly after assembly and after specific

LED Lighting

LED Lighting
  • Author : T. Q. Khan,P. Bodrogi,Q. T. Vinh,H. Winkler
  • Publisher : John Wiley & Sons
  • Release : 24 November 2014
GET THIS BOOKLED Lighting

Promoting the design, application and evaluation of visually and electrically effective LED light sources and luminaires for general indoor lighting as well as outdoor and vehicle lighting, this book combines the knowledge of LED lighting technology with human perceptual aspects for lighting scientists and engineers. After an introduction to the human visual system and current radiometry, photometry and color science, the basics of LED chip and phosphor technology are described followed by specific issues of LED radiometry and the optical,

Manufacturing Process Technology

Manufacturing Process Technology
  • Author : Zheng Yi Jiang,Shan Qing Li,Jianmin Zeng,Xiaoping Liao,Dao Guo Yang
  • Publisher : Trans Tech Publications Ltd
  • Release : 21 February 2011
GET THIS BOOKManufacturing Process Technology

This special volume aims to bring together the latest advances in, and applications of, surface engineering/coatings, modeling, analysis and simulation, materials forming, materials machining, welding and joining, laser-processing technology, casting and solidification, precision manufacturing technology and measurements, etc. It will not only furnish readers with a broad overview of the latest advances, but also provide a valuable summary and reference work for researchers in this field.