Reliability Prediction from Burn In Data Fit to Reliability Models

This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. The ability to include reliability calculations and test results in their product design The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions Have accurate failure rate calculations for calculating warrantee period replacement costs

Produk Detail:

  • Author : Joseph Bernstein
  • Publisher : Academic Press
  • Pages : 108 pages
  • ISBN : 0128008199
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKReliability Prediction from Burn In Data Fit to Reliability Models

Reliability Prediction from Burn-In Data Fit to Reliability Models

Reliability Prediction from Burn-In Data Fit to Reliability Models
  • Author : Joseph Bernstein
  • Publisher : Academic Press
  • Release : 06 March 2014
GET THIS BOOKReliability Prediction from Burn-In Data Fit to Reliability Models

This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part

Reliability Modeling: The RIAC Guide to Reliability Prediction, Assessment and Estimation

Reliability Modeling: The RIAC Guide to Reliability Prediction, Assessment and Estimation
  • Author : William Denson
  • Publisher : RIAC
  • Release : 01 January 2006
GET THIS BOOKReliability Modeling: The RIAC Guide to Reliability Prediction, Assessment and Estimation

The intent of this book is to provide guidance on modeling techniques that can be used to quantify the reliability of a product or system. In this context, reliability modeling is the process of constructing a mathematical model that is used to estimate the reliability characteristics of a product. There are many ways in which this can be accomplished, depending on the product or system and the type of information that is available, or practical to obtain. This book reviews

System Reliability

System Reliability
  • Author : Constantin Volosencu
  • Publisher : BoD – Books on Demand
  • Release : 20 December 2017
GET THIS BOOKSystem Reliability

Researchers from the entire world write to figure out their newest results and to contribute new ideas or ways in the field of system reliability and maintenance. Their articles are grouped into four sections: reliability, reliability of electronic devices, power system reliability and feasibility and maintenance. The book is a valuable tool for professors, students and professionals, with its presentation of issues that may be taken as examples applicable to practical situations. Some examples defining the contents can be highlighted:

Thermal and Power Management of Integrated Circuits

Thermal and Power Management of Integrated Circuits
  • Author : Arman Vassighi,Manoj Sachdev
  • Publisher : Springer Science & Business Media
  • Release : 01 June 2006
GET THIS BOOKThermal and Power Management of Integrated Circuits

In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in

Lifetime Data: Models in Reliability and Survival Analysis

Lifetime Data: Models in Reliability and Survival Analysis
  • Author : Nicholas P. Jewell,Alan C. Kimber,Mei-Ling Ting Lee,G. Alex Whitmore
  • Publisher : Springer Science & Business Media
  • Release : 17 April 2013
GET THIS BOOKLifetime Data: Models in Reliability and Survival Analysis

Statistical models and methods for lifetime and other time-to-event data are widely used in many fields, including medicine, the environmental sciences, actuarial science, engineering, economics, management, and the social sciences. For example, closely related statistical methods have been applied to the study of the incubation period of diseases such as AIDS, the remission time of cancers, life tables, the time-to-failure of engineering systems, employment duration, and the length of marriages. This volume contains a selection of papers based on the 1994

Reliability, Yield, and Stress Burn-In

Reliability, Yield, and Stress Burn-In
  • Author : Way Kuo,Wei-Ting Kary Chien,Taeho Kim
  • Publisher : Springer Science & Business Media
  • Release : 27 November 2013
GET THIS BOOKReliability, Yield, and Stress Burn-In

The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of