Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

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  • Author : E-H Wong
  • Publisher : Woodhead Publishing
  • Pages : 482 pages
  • ISBN : 0857099116
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKRobust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
  • Author : E-H Wong,Y.-W. Mai
  • Publisher : Woodhead Publishing
  • Release : 23 May 2015
GET THIS BOOKRobust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are

Polymers in Organic Electronics

Polymers in Organic Electronics
  • Author : Sulaiman Khalifeh
  • Publisher : Elsevier
  • Release : 01 April 2020
GET THIS BOOKPolymers in Organic Electronics

Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes,

Microelectromechanical Systems

Microelectromechanical Systems
  • Author : National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems
  • Publisher : National Academies Press
  • Release : 01 January 1998
GET THIS BOOKMicroelectromechanical Systems

Microelectromenchanical systems (MEMS) is a revolutionary field that adapts for new uses a technology already optimized to accomplish a specific set of objectives. The silicon-based integrated circuits process is so highly refined it can produce millions of electrical elements on a single chip and define their critical dimensions to tolerances of 100-billionths of a meter. The MEMS revolution harnesses the integrated circuitry know-how to build working microsystems from micromechanical and microelectronic elements. MEMS is a multidisciplinary field involving challenges and

Mechanics of Microelectronics

Mechanics of Microelectronics
  • Author : G.Q. Zhang,W.D. van Driel,X.J. Fan
  • Publisher : Springer Science & Business Media
  • Release : 25 August 2006
GET THIS BOOKMechanics of Microelectronics

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

System Reliability

System Reliability
  • Author : Constantin Volosencu
  • Publisher : BoD – Books on Demand
  • Release : 20 December 2017
GET THIS BOOKSystem Reliability

Researchers from the entire world write to figure out their newest results and to contribute new ideas or ways in the field of system reliability and maintenance. Their articles are grouped into four sections: reliability, reliability of electronic devices, power system reliability and feasibility and maintenance. The book is a valuable tool for professors, students and professionals, with its presentation of issues that may be taken as examples applicable to practical situations. Some examples defining the contents can be highlighted:

Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies

Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies
  • Author : Kenichi Takahata
  • Publisher : BoD – Books on Demand
  • Release : 29 May 2013
GET THIS BOOKAdvances in Micro/Nano Electromechanical Systems and Fabrication Technologies

MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these

Handbook of Electronic Waste Management

Handbook of Electronic Waste Management
  • Author : Majeti Narasimha Vara Prasad,Meththika Vithanage,Anwesha Borthakur
  • Publisher : Butterworth-Heinemann
  • Release : 21 November 2019
GET THIS BOOKHandbook of Electronic Waste Management

Handbook of Electronic Waste Management: International Best Practices and Case Studies begin with a brief summary of the environmental challenges associated with the approaches used in international e-waste handling. The book's authors offer a detailed presentation of e-waste handling methods that also includes examples to further demonstrate how they work in the real world. This is followed by data that reveals the geographies of e-waste flows at global, national and subnational levels. Users will find this resource to be a

Orbital Mechanics for Engineering Students

Orbital Mechanics for Engineering Students
  • Author : Howard D Curtis
  • Publisher : Elsevier
  • Release : 26 October 2009
GET THIS BOOKOrbital Mechanics for Engineering Students

Orbital Mechanics for Engineering Students, Second Edition, provides an introduction to the basic concepts of space mechanics. These include vector kinematics in three dimensions; Newton’s laws of motion and gravitation; relative motion; the vector-based solution of the classical two-body problem; derivation of Kepler’s equations; orbits in three dimensions; preliminary orbit determination; and orbital maneuvers. The book also covers relative motion and the two-impulse rendezvous problem; interplanetary mission design using patched conics; rigid-body dynamics used to characterize the attitude

Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging
  • Author : Xingcun Colin Tong
  • Publisher : Springer Science & Business Media
  • Release : 05 January 2011
GET THIS BOOKAdvanced Materials for Thermal Management of Electronic Packaging

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining

Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
  • Author : James J. Licari,Dale W. Swanson
  • Publisher : William Andrew
  • Release : 24 June 2011
GET THIS BOOKAdhesives Technology for Electronic Applications

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework