Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Produk Detail:

  • Author : E-H Wong
  • Publisher : Woodhead Publishing
  • Pages : 482 pages
  • ISBN : 0857099116
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKRobust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
  • Author : E-H Wong,Y.-W. Mai
  • Publisher : Woodhead Publishing
  • Release : 23 May 2015
GET THIS BOOKRobust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are

Directed Self-assembly of Block Co-polymers for Nano-manufacturing

Directed Self-assembly of Block Co-polymers for Nano-manufacturing
  • Author : Roel Gronheid,Paul Nealey
  • Publisher : Woodhead Publishing
  • Release : 17 July 2015
GET THIS BOOKDirected Self-assembly of Block Co-polymers for Nano-manufacturing

The directed self-assembly (DSA) method of patterning for microelectronics uses polymer phase-separation to generate features of less than 20nm, with the positions of self-assembling materials externally guided into the desired pattern. Directed self-assembly of Block Co-polymers for Nano-manufacturing reviews the design, production, applications and future developments needed to facilitate the widescale adoption of this promising technology. Beginning with a solid overview of the physics and chemistry of block copolymer (BCP) materials, Part 1 covers the synthesis of new materials and new

Advances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP)
  • Author : Suryadevara Babu
  • Publisher : Woodhead Publishing
  • Release : 09 January 2016
GET THIS BOOKAdvances in Chemical Mechanical Planarization (CMP)

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of

Rare Earth and Transition Metal Doping of Semiconductor Materials

Rare Earth and Transition Metal Doping of Semiconductor Materials
  • Author : Volkmar Dierolf,Ian Ferguson,John M Zavada
  • Publisher : Woodhead Publishing
  • Release : 23 January 2016
GET THIS BOOKRare Earth and Transition Metal Doping of Semiconductor Materials

Rare Earth and Transition Metal Doping of Semiconductor Material explores traditional semiconductor devices that are based on control of the electron’s electric charge. This book looks at the semiconductor materials used for spintronics applications, in particular focusing on wide band-gap semiconductors doped with transition metals and rare earths. These materials are of particular commercial interest because their spin can be controlled at room temperature, a clear opposition to the most previous research on Gallium Arsenide, which allowed for control

Optical Interconnects for Data Centers

Optical Interconnects for Data Centers
  • Author : Tolga Tekin,Nikos Pleros,Richard Pitwon,Andreas Hakansson
  • Publisher : Woodhead Publishing
  • Release : 01 November 2016
GET THIS BOOKOptical Interconnects for Data Centers

Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such

Mechanics of Microelectronics

Mechanics of Microelectronics
  • Author : G.Q. Zhang,W.D. van Driel,X.J. Fan
  • Publisher : Springer Science & Business Media
  • Release : 25 August 2006
GET THIS BOOKMechanics of Microelectronics

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Advanced Industrial Control Technology

Advanced Industrial Control Technology
  • Author : Peng Zhang
  • Publisher : William Andrew
  • Release : 26 August 2010
GET THIS BOOKAdvanced Industrial Control Technology

Control engineering seeks to understand physical systems, using mathematical modeling, in terms of inputs, outputs and various components with different behaviors. It has an essential role in a wide range of control systems, from household appliances to space flight. This book provides an in-depth view of the technologies that are implemented in most varieties of modern industrial control engineering. A solid grounding is provided in traditional control techniques, followed by detailed examination of modern control techniques such as real-time, distributed,

Orbital Mechanics for Engineering Students

Orbital Mechanics for Engineering Students
  • Author : Howard D Curtis
  • Publisher : Elsevier
  • Release : 26 October 2009
GET THIS BOOKOrbital Mechanics for Engineering Students

Orbital Mechanics for Engineering Students, Second Edition, provides an introduction to the basic concepts of space mechanics. These include vector kinematics in three dimensions; Newton’s laws of motion and gravitation; relative motion; the vector-based solution of the classical two-body problem; derivation of Kepler’s equations; orbits in three dimensions; preliminary orbit determination; and orbital maneuvers. The book also covers relative motion and the two-impulse rendezvous problem; interplanetary mission design using patched conics; rigid-body dynamics used to characterize the attitude

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging
  • Author : Kim S. Siow
  • Publisher : Springer
  • Release : 29 January 2019
GET THIS BOOKDie-Attach Materials for High Temperature Applications in Microelectronics Packaging

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to

Microelectronics Fialure Analysis Desk Reference, Seventh Edition

Microelectronics Fialure Analysis Desk Reference, Seventh Edition
  • Author : Tejinder Gandhi
  • Publisher : ASM International
  • Release : 01 November 2019
GET THIS BOOKMicroelectronics Fialure Analysis Desk Reference, Seventh Edition

The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major