Three dimensional Integrated Circuit Design

"Three-dimensional integrated circuit design has become a viable and necessary solution for the difficult issue of on-chip interconnect. Vasilis Pavlidis and Eby Friedman have provided the first unified treatment of these circuits - focusing on effective design methodologies with consideration to fabrication processes. Three-dimensional or vertical integration boosts performance and extends the capabilities of modern integrated circuits. Various 3-D circuit architectures are discussed in detail - including processors and memory systems, FPGAs, and on-chip networks. This book provides the reader with the knowledge and toolkit needed to enhance the performance and functionality of three-dimensional circuits and related applications." --Book Jacket.

Produk Detail:

  • Author : Vasilis F. Pavlidis
  • Publisher : Morgan Kaufmann Pub
  • Pages : 309 pages
  • ISBN : 9780123743435
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKThree dimensional Integrated Circuit Design

Three-dimensional Integrated Circuit Design

Three-dimensional Integrated Circuit Design
  • Author : Vasilis F. Pavlidis,Eby G. Friedman
  • Publisher : Morgan Kaufmann Pub
  • Release : 28 October 2021
GET THIS BOOKThree-dimensional Integrated Circuit Design

"Three-dimensional integrated circuit design has become a viable and necessary solution for the difficult issue of on-chip interconnect. Vasilis Pavlidis and Eby Friedman have provided the first unified treatment of these circuits - focusing on effective design methodologies with consideration to fabrication processes. Three-dimensional or vertical integration boosts performance and extends the capabilities of modern integrated circuits. Various 3-D circuit architectures are discussed in detail - including processors and memory systems, FPGAs, and on-chip networks. This book provides the reader

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer Science & Business Media
  • Release : 02 December 2009
GET THIS BOOKThree-Dimensional Integrated Circuit Design

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design
  • Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
  • Publisher : Newnes
  • Release : 04 July 2017
GET THIS BOOKThree-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions

Design of 3D Integrated Circuits and Systems

Design of 3D Integrated Circuits and Systems
  • Author : Rohit Sharma
  • Publisher : CRC Press
  • Release : 03 September 2018
GET THIS BOOKDesign of 3D Integrated Circuits and Systems

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application

Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits
  • Author : Aida Todri-Sanial,Chuan Seng Tan
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOKPhysical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3

Electrical Modeling and Design for 3D System Integration

Electrical Modeling and Design for 3D System Integration
  • Author : Er-Ping Li
  • Publisher : John Wiley & Sons
  • Release : 10 April 2012
GET THIS BOOKElectrical Modeling and Design for 3D System Integration

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
  • Author : Sung Kyu Lim
  • Publisher : Springer Science & Business Media
  • Release : 27 November 2012
GET THIS BOOKDesign for High Performance, Low Power, and Reliable 3D Integrated Circuits

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only

Handbook of 3D Integration, Volume 4

Handbook of 3D Integration, Volume 4
  • Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
  • Publisher : John Wiley & Sons
  • Release : 25 January 2019
GET THIS BOOKHandbook of 3D Integration, Volume 4

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while

3D Integration in VLSI Circuits

3D Integration in VLSI Circuits
  • Author : Katsuyuki Sakuma
  • Publisher : CRC Press
  • Release : 17 April 2018
GET THIS BOOK3D Integration in VLSI Circuits

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed

Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology
  • Author : Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif
  • Publisher : Springer Science & Business Media
  • Release : 29 June 2009
GET THIS BOOKWafer Level 3-D ICs Process Technology

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Handbook of 3D Integration, Volume 1

Handbook of 3D Integration, Volume 1
  • Author : Philip Garrou,Christopher Bower,Peter Ramm
  • Publisher : John Wiley & Sons
  • Release : 22 September 2011
GET THIS BOOKHandbook of 3D Integration, Volume 1

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the

Die-stacking Architecture

Die-stacking Architecture
  • Author : Yuan Xie,Jishen Zhao
  • Publisher : Morgan & Claypool Publishers
  • Release : 01 June 2015
GET THIS BOOKDie-stacking Architecture

The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to

3D Integration for NoC-based SoC Architectures

3D Integration for NoC-based SoC Architectures
  • Author : Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch
  • Publisher : Springer Science & Business Media
  • Release : 08 November 2010
GET THIS BOOK3D Integration for NoC-based SoC Architectures

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer
  • Release : 10 December 2009
GET THIS BOOKThree-Dimensional Integrated Circuit Design

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the

Designing 2D and 3D Network-on-Chip Architectures

Designing 2D and 3D Network-on-Chip Architectures
  • Author : Konstantinos Tatas,Kostas Siozios,Dimitrios Soudris,Axel Jantsch
  • Publisher : Springer Science & Business Media
  • Release : 08 October 2013
GET THIS BOOKDesigning 2D and 3D Network-on-Chip Architectures

This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.