Three dimensional Integrated Circuit Design

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. * Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers * The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find * Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D * Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits

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  • Author : Vasilis F. Pavlidis
  • Publisher : Morgan Kaufmann
  • Pages : 336 pages
  • ISBN : 9780080921860
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKThree dimensional Integrated Circuit Design

Three-dimensional Integrated Circuit Design

Three-dimensional Integrated Circuit Design
  • Author : Vasilis F. Pavlidis,Eby G. Friedman
  • Publisher : Morgan Kaufmann
  • Release : 28 July 2010
GET THIS BOOKThree-dimensional Integrated Circuit Design

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer Science & Business Media
  • Release : 02 December 2009
GET THIS BOOKThree-Dimensional Integrated Circuit Design

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the

Design of 3D Integrated Circuits and Systems

Design of 3D Integrated Circuits and Systems
  • Author : Rohit Sharma
  • Publisher : CRC Press
  • Release : 03 September 2018
GET THIS BOOKDesign of 3D Integrated Circuits and Systems

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application

Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits
  • Author : Aida Todri-Sanial,Chuan Seng Tan
  • Publisher : CRC Press
  • Release : 19 December 2017
GET THIS BOOKPhysical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
  • Author : Sung Kyu Lim
  • Publisher : Springer Science & Business Media
  • Release : 27 November 2012
GET THIS BOOKDesign for High Performance, Low Power, and Reliable 3D Integrated Circuits

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design
  • Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
  • Publisher : Newnes
  • Release : 04 July 2017
GET THIS BOOKThree-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions

Electrical Modeling and Design for 3D System Integration

Electrical Modeling and Design for 3D System Integration
  • Author : Er-Ping Li
  • Publisher : John Wiley & Sons
  • Release : 10 April 2012
GET THIS BOOKElectrical Modeling and Design for 3D System Integration

New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular

3D Integration in VLSI Circuits

3D Integration in VLSI Circuits
  • Author : Katsuyuki Sakuma
  • Publisher : CRC Press
  • Release : 17 April 2018
GET THIS BOOK3D Integration in VLSI Circuits

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed

Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology
  • Author : Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif
  • Publisher : Springer Science & Business Media
  • Release : 29 June 2009
GET THIS BOOKWafer Level 3-D ICs Process Technology

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Three-Dimensional Integrated Circuit Design

Three-Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer
  • Release : 19 May 2010
GET THIS BOOKThree-Dimensional Integrated Circuit Design

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the

Designing TSVs for 3D Integrated Circuits

Designing TSVs for 3D Integrated Circuits
  • Author : Nauman Khan,Soha Hassoun
  • Publisher : Springer Science & Business Media
  • Release : 22 September 2012
GET THIS BOOKDesigning TSVs for 3D Integrated Circuits

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs,

Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits
  • Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
  • Publisher : Springer
  • Release : 21 August 2014
GET THIS BOOKArbitrary Modeling of TSVs for 3D Integrated Circuits

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as

3D Integration for NoC-based SoC Architectures

3D Integration for NoC-based SoC Architectures
  • Author : Abbas Sheibanyrad,Frédéric Pétrot,Axel Jantsch
  • Publisher : Springer Science & Business Media
  • Release : 08 November 2010
GET THIS BOOK3D Integration for NoC-based SoC Architectures

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book

High Performance Integrated Circuit Design

High Performance Integrated Circuit Design
  • Author : Emre Salman,Eby Friedman
  • Publisher : McGraw Hill Professional
  • Release : 21 August 2012
GET THIS BOOKHigh Performance Integrated Circuit Design

The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to

Handbook of 3D Integration, Volume 1

Handbook of 3D Integration, Volume 1
  • Author : Philip Garrou,Christopher Bower,Peter Ramm
  • Publisher : John Wiley & Sons
  • Release : 22 September 2011
GET THIS BOOKHandbook of 3D Integration, Volume 1

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the