Three dimensional Molded Interconnect Devices 3D MID

Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MID are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MID are used in virtually every sector of electronics. The many standard applications for MID in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications, and industrial automation with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

Produk Detail:

  • Author : Jörg Franke
  • Publisher : Hanser Pub Incorporated
  • Pages : 356 pages
  • ISBN : 9781569905517
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKThree dimensional Molded Interconnect Devices 3D MID

Three-dimensional Molded Interconnect Devices (3D-MID)

Three-dimensional Molded Interconnect Devices (3D-MID)
  • Author : Jörg Franke
  • Publisher : Hanser Pub Incorporated
  • Release : 19 May 2021
GET THIS BOOKThree-dimensional Molded Interconnect Devices (3D-MID)

Three-dimensional molded interconnect devices (MID) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MID are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MID are used in virtually every sector of electronics.

11th International Congress Molded Interconnect Devices – Scientific Proceedings

11th International Congress Molded Interconnect Devices – Scientific Proceedings
  • Author : Jörg Franke,Thomas Kuhn,Albert Birkicht,Andreas Pojtinger
  • Publisher : Trans Tech Publications Ltd
  • Release : 26 September 2014
GET THIS BOOK11th International Congress Molded Interconnect Devices – Scientific Proceedings

Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability.

Proceedings of the 6th CIRP-Sponsored International Conference on Digital Enterprise Technology

Proceedings of the 6th CIRP-Sponsored International Conference on Digital Enterprise Technology
  • Author : George Q. Huang,K.L. Mak,Paul G. Maropoulos
  • Publisher : Springer Science & Business Media
  • Release : 12 December 2009
GET THIS BOOKProceedings of the 6th CIRP-Sponsored International Conference on Digital Enterprise Technology

This Proceedings volume contains articles presented at the CIRP-Sponsored Inter- tional Conference on Digital Enterprise Technology (DET2009) that takes place December 14–16, 2009 in Hong Kong. This is the 6th DET conference in the series and the first to be held in Asia. Professor Paul Maropoulos initiated, hosted and chaired the 1st International DET Conference held in 2002 at the University of D- ham. Since this inaugural first DET conference, DET conference series has been s- cessfully held in 2004 at Seattle, Washington USA,

Microengineering of Metals and Ceramics, Part I

Microengineering of Metals and Ceramics, Part I
  • Author : Henry Baltes,Oliver Brand,Gary K. Fedder,Christofer Hierold,Jan G. Korvink,Osamu Tabata,Detlef Löhe,Jürgen Hausselt
  • Publisher : Wiley-VCH
  • Release : 19 May 2021
GET THIS BOOKMicroengineering of Metals and Ceramics, Part I

Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. In this volume, authors from three major competence centres for microengineering illustrate step by step the process from

Manufacturing Engineering and Automation I

Manufacturing Engineering and Automation I
  • Author : Liangchi Zhang,Chun Liang Zhang,Tie Lin Shi
  • Publisher : Trans Tech Publications Ltd
  • Release : 19 October 2010
GET THIS BOOKManufacturing Engineering and Automation I

This special volume brings together the latest advances in, and applications of, Manufacturing Engineering and Automation. It comprises 598 peer-reviewed papers selected from over 1000 papers submitted by universities and industrial concerns all over the world. Volume is indexed by Thomson Reuters CPCI-S (WoS).

Innovation

Innovation
  • Author : Anonim
  • Publisher : Unknown Publisher
  • Release : 19 May 1994
GET THIS BOOKInnovation

One issue each year consists of an annual conference review.

Robotics in Smart Manufacturing

Robotics in Smart Manufacturing
  • Author : Pedro Neto,António Paulo Moreira
  • Publisher : Springer
  • Release : 12 June 2013
GET THIS BOOKRobotics in Smart Manufacturing

This book constitutes the refereed proceedings of the International Workshop on Robotics in Smart Manufacturing, WRSM 2013, held in Porto, Portugal, in June 2013. The 20 revised full papers presented were carefully reviewed and selected from numerous submissions. The papers address issues such as robotic machining, off-line robot programming, robot calibration, new robotic hardware and software architectures, advanced robot teaching methods, intelligent warehouses, robot co-workers and application of robots in the textile industry.

Microengineering of Metals and Ceramics

Microengineering of Metals and Ceramics
  • Author : Henry Baltes,Oliver Brand,Gary K. Fedder,Christofer Hierold,Jan G. Korvink,Osamu Tabata,Detlef Löhe,Jürgen Hausselt
  • Publisher : Wiley-VCH
  • Release : 19 May 2021
GET THIS BOOKMicroengineering of Metals and Ceramics

Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Continuing from the previous volume, authors from three major competence centres for microengineering here cover all aspects of