Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Produk Detail:

  • Author : Katsuaki Suganuma
  • Publisher : Woodhead Publishing
  • Pages : 240 pages
  • ISBN : 9780081020944
  • Rating : 4/5 from 21 reviews
CLICK HERE TO GET THIS BOOKWide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging
  • Author : Katsuaki Suganuma
  • Publisher : Woodhead Publishing
  • Release : 13 June 2018
GET THIS BOOKWide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power

Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging
  • Author : Katsuaki Suganuma
  • Publisher : Woodhead Publishing
  • Release : 28 May 2018
GET THIS BOOKWide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power

Wide Bandgap Semiconductor Power Devices

Wide Bandgap Semiconductor Power Devices
  • Author : B. Jayant Baliga
  • Publisher : Woodhead Publishing
  • Release : 17 October 2018
GET THIS BOOKWide Bandgap Semiconductor Power Devices

Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of the Power Semiconductor Research Center at North Carolina State University (and creator of the IGBT device), Dr. B. Jayant Baliga is one of the highest regarded experts in the field.

Semiconductor Power Devices

Semiconductor Power Devices
  • Author : Josef Lutz,Heinrich Schlangenotto,Uwe Scheuermann,Rik De Doncker
  • Publisher : Springer
  • Release : 16 February 2018
GET THIS BOOKSemiconductor Power Devices

Halbleiter-Leistungsbauelemente sind das Kernstück der Leistungselektronik. Sie bestimmen die Leistungsfähigkeit und machen neuartige und verlustarme Schaltungen erst möglich. In dem Band wird neben den Halbleiter-Leistungsbauelementen selbst auch die Aufbau- und Verbindungstechnik behandelt: von den physikalischen Grundlagen und der Herstellungstechnologie über einzelne Bauelemente bis zu thermomechanischen Problemen, Zerstörungsmechanismen und Störungseffekten. Die 2., überarbeitete Auflage berücksichtigt technische Neuerungen und Entwicklungen.

Thermal and Electro-thermal System Simulation 2020

Thermal and Electro-thermal System Simulation 2020
  • Author : Márta Rencz,Lorenzo Codecasa,Andras Poppe
  • Publisher : MDPI
  • Release : 12 January 2021
GET THIS BOOKThermal and Electro-thermal System Simulation 2020

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at

Electronic Enclosures, Housings and Packages

Electronic Enclosures, Housings and Packages
  • Author : Frank Suli
  • Publisher : Woodhead Publishing
  • Release : 15 November 2018
GET THIS BOOKElectronic Enclosures, Housings and Packages

Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and

High-Performance Packaging Technology for Wide Bandgap Semiconductor Modules

High-Performance Packaging Technology for Wide Bandgap Semiconductor Modules
  • Author : Paul Mumby-Croft
  • Publisher : Unknown Publisher
  • Release : 29 July 2021
GET THIS BOOKHigh-Performance Packaging Technology for Wide Bandgap Semiconductor Modules

The properties of wide band gap (WBG) semiconductors are beneficial to power electronics applications ranging from consumer electronics and renewable energy to electric vehicles and high-power traction applications like high-speed trains. WBG devices, properly integrated, will allow power electronics systems to be smaller, lighter, operate at higher temperatures, and at higher frequencies than previous generations of Si-based systems. These will contribute to higher efficiency, and therefore, lower lifecycle costs and lower CO2 emissions. Over 20 years have been spent developing WBG

Disruptive Wide Bandgap Semiconductors, Related Technologies, and Their Applications

Disruptive Wide Bandgap Semiconductors, Related Technologies, and Their Applications
  • Author : Yogesh Kumar Sharma
  • Publisher : BoD – Books on Demand
  • Release : 12 September 2018
GET THIS BOOKDisruptive Wide Bandgap Semiconductors, Related Technologies, and Their Applications

SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations in high-temperature, high-voltage, and high-frequency regimes. With the help of SiC and GaN devices, it is possible to realize more efficient power systems. Devices manufactured from SiC and GaN have

High Temperature Packaging for Wide Bandgap Semiconductor Devices

High Temperature Packaging for Wide Bandgap Semiconductor Devices
  • Author : Brian J. Grummel
  • Publisher : Unknown Publisher
  • Release : 29 July 2021
GET THIS BOOKHigh Temperature Packaging for Wide Bandgap Semiconductor Devices

Currently, wide bandgap semiconductor devices feature increased efficiency, higher current handling capabilities, and higher reverse blocking voltages than silicon devices while recent fabrication advances have them drawing near to the marketplace. However these new semiconductors are in need of new packaging that will allow for their application in several important uses including hybrid electrical vehicles, new and existing energy sources, and increased efficiency in multiple new and existing technologies. Also, current power module designs for silicon devices are rife with

Power Electronic Packaging

Power Electronic Packaging
  • Author : Yong Liu
  • Publisher : Springer Science & Business Media
  • Release : 15 February 2012
GET THIS BOOKPower Electronic Packaging

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC)

Design and Characterization of High-temperature Packaging for Wide-bandgap Semiconductor Devices

Design and Characterization of High-temperature Packaging for Wide-bandgap Semiconductor Devices
  • Author : Brian J. Grummel
  • Publisher : Unknown Publisher
  • Release : 29 July 2021
GET THIS BOOKDesign and Characterization of High-temperature Packaging for Wide-bandgap Semiconductor Devices

This was confirmed by electrical resistivity measurement, EDS, FIB, and SEM characterization. Thermal and mechanical characterization of TLP die-attached samples was also performed to gain a newfound understanding of the relationship between TLP design parameters and die-attach properties. Samples with a SiC diode chip TLP bonded to a copper metalized silicon nitride substrate were made using several different values of fabrication parameters such as gold and indium thickness, Au-In ratio, and bonding pressure. The TLP bonds were then characterized for

Characterization of Wide Bandgap Power Semiconductor Devices

Characterization of Wide Bandgap Power Semiconductor Devices
  • Author : Fei Wang,Zheyu Zhang,Edward A. Jones
  • Publisher : Institution of Engineering and Technology
  • Release : 29 July 2021
GET THIS BOOKCharacterization of Wide Bandgap Power Semiconductor Devices

At the heart of modern power electronics converters are power semiconductor switching devices. The emergence of wide bandgap (WBG) semiconductor devices, including silicon carbide and gallium nitride, promises power electronics converters with higher efficiency, smaller size, lighter weight, and lower cost than converters using the established silicon-based devices. However, WBG devices pose new challenges for converter design and require more careful characterization, in particular due to their fast switching speed and more stringent need for protection. Characterization of Wide Bandgap

Materials for High-Temperature Semiconductor Devices

Materials for High-Temperature Semiconductor Devices
  • Author : National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Materials for High-Temperature Semiconductor Devices
  • Publisher : National Academies Press
  • Release : 14 October 1995
GET THIS BOOKMaterials for High-Temperature Semiconductor Devices

Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.